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Innerlayer Registration (Post Etch Punch)
  In a typical "pre-exposure" registration system, layer to layer registration is achieved by aligning innerlayer artwork to a drilled master panel (first article) and punching the artwork with tooling slots or holes. The tooling punched in the artwork matches the tooling that is punched in the innerlayer laminate. The artwork and laminate are pinned together and exposed. The "pre-exposure" system has been the accepted method of multilayer registration since the inception of multilayers. The demands of tighter circuitry on thinner and larger panels required Multiline engineers to relook at how to improve accuracy. Working with our customers, Multiline developed and patented the first machines to align and punch a panel after etching by automatically splitting the error due to dimensional instability and all previous errors. This Multiline Technology development was coined Post & Etch Punching:

The etched innerlayers are placed onto a pre-alignment station. This station is a table which extends from the front of the machine with two low magnification cameras mounted on a moveable rail. The low magnification cameras are set to the same panel size as the primary cameras in the machine. The Operator then locates the panel under the cameras on the pre-alignment table and pushes the start button. The panel is transported from the pre-alignment table into the machine by a linear vacuum feed device. To insure safe and fast loading, the platform becomes an air table while the innerlayer is being transported.

The tooling pattern is punched in the innerlayer after etching. All material movement resulting from artwork instability, etching, black oxiding, etc. is compensated for. The innerlayer is crowded to the center of the station of the station where it is picked up and transported to the automatic video pre-alignment cameras by the innerlayer transport system.

Tooling holes and/or slots that are punched before etching are subject to movement during the etching process. This results in buckling or stretching of the innerlayers when pinning on the lamination plates which can cause misregistration. Post­etch punching eliminates this problem, insuring an accurate match between the innerlayer tooling holes and lamination plates.

Slots and/or holes punched in the laminate prior to etching are subject to copper loss around the tooling. Post etch punching allows copper to remain around the tooling holes for additional strength duringlamination.

The PE has the added advantage of providing Statistical ProcessControl data (SPC). The SPC data shows the difference in mils between the innerlayer targets and the machine reference targets. This information can be collected and used to evaluate prior processes as well as reaction of different materials. A tolerance window can also be set, specifiying a maximum allowable material shift. Innerlayers outside this range would either be automatically rejected or could be grouped with layers of similar movement.

As the panel passes from the conveyor section to the crowder section, a light bar sensor measures the length of the panel (X) Dim and a separate sensor measures the width (Y) Dim. The sensors send the information to the unit and a determination is made as to which, if any, punch blocks need to be moved to a new position. This feature eliminates the need for an operator to input the panel size and allows the machine to process different panel sizes without shutting down the line. It also automatically sets the panel pre-positioning station, the punch block positions, the camera positions and the pick and place locations on the material transport system.




 
Alignment-Optimizer-Department
 
PE-Punch - ML-Registration

Optiline Post-Etch-Punch (Fab.: Multiline Technology Inc) for Inner Layers, (t050, t090)
 
+ zoom + + zoom +
- Inner Layer Registration System with
  Statistical Process Control
- Panel Size: Up to 24" x 28"
- Punch Position Accuracy: +- 0.001" X or   Y position to datum over 28".
- Punch Repeatability: +- 0.0005"
- Image to Punch Accuracy: +- 0.001" at   center of panel


Lenz Optical Detection Multilayer-Drilling-Machine to optimize the offset
+ zoom +
- Inner Layer Registration System with Statistical Process   Control
- Panel Size: Up to 24" x 28"
- Punch Position Accuracy: +- 0.001" X or Y position to datum   over 28".
- Punch Repeatability: +- 0.0005"
- Image to Punch Accuracy: +- 0.001" at center of panel


 
| MicroCirtec Micro Circuit Technology GmbH resident in 47877 Willich-Germany |
| Registered at the Krefeld District Court | Registration No. HRB 2703 | VAT-ID-No.: DE 120 151 127 |
| Management: Hildegard Völker & Andreas Brüggen | Post Address: 47805 Krefeld, Oberdiessemer Strasse 15 |
| Telephone: ++49 (0) 21 51 825 1 | Telefax: ++49 (0) 21 51 932 450 | eMail: tecline@microcirtec.com |

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Friday, October 31, 2014