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Technical Terms of Delivery |
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Of MicroCirtec GmbH (Revision: 01 of 01.Juli 2004)
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1.1
The day, on which the order and the complete production data are made available not later than 6 p.m.,
does not count as a working day. If the order and/or the production data are made available after 6
p.m., the first working day is t he day after next.
1.2
Technical preconditions: Productions data and orders which are faulty, incomplete, or vary from the details
on which the offer is based lead to delays in delivery and/or incorrect execution of the order, etc.
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2.1
We do not accept responsibility for any errors incurred when referring to offers or when enquiring.
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3.1
In order to be able to recognise the correct side (mirrored or unmirrored image) legible type must
be visible in an external position on the conductive pattern.
3.2
The order of layer construction must be given for multilayers. We are not liable for correct execution
if we are not provided with this information.
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We cannot accept liability for any incorrect
execution of PCBs if a file description is not provided.
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5.1
We are not liable for errors occurring as a result of converting Eagle-BRD files into gerber data.
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6.1
To guarantee an adequate annular ring encircling plated-through drills, the pad should have a surround
of at least 300µ around the hole.
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7.1
If non-plated holes are positioned on one pad, the pad must have a surround of at least 500µ larger
than the hole. Otherwise some/all of the pads may be removed.
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8.1
Please refrain from oversizing when drafting solder resists, i.e. the solder stop spaces are 1:1
to the pads. This facilitates the incorporation and required stretching of the solder resists during
the manufacturing process.
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9.1
In order to perfectly reproduce silkscreens, the type must be at least 1mm high and the stroke at
least 200µ thick. Also, all surrounding solder areas must be clear of component print for
at least 250µ or imperfect print and printed solder areas may result.
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10.1
This refers to plated through PCBs: If we do not have any information from you as to which holes
are to be plated-through and which are not, we will determine this to the best of our knowledge.
10.2
If non-plated holes are positioned in a pad, this pad must be bigger than the hole by at least factor 1.5. Otherwise some or all of the pads may be removed.
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| 11. Data Provided (Data Inconsistency) |
  
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11.1
If drilling and measurement plans are included that do not match the drilling program or the contour
according to the gerber-data, then the drilling program and the gerber-data will be binding in
all cases.
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12.1
If not otherwise stipulated, the PCB contour will be determined by the centre (=centre vector) of
the contour lines provided in the order data. If Slots are represented by you by rectangular outlines,
then we assume generally that the corner radius is contained.
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| 13. Technical Specifications |
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13.1
For further technical specifications of our manufacturing processes, please refer to our
Process & Capability Manual
in the "Standard" category. These standard technical criteria also apply even
if your manufacturing data and documents call for other features (special technical requirements are
available in our Premium Jet Line).
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14.1
If the PCB is to be produced in line with our UL Certification, please follow the layout instructions..
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15.1
The minimum spacing of not plated through holes/plated through holes not surrounded by a pad to innerlayer copper must be at least 400 µ. The minimum spacing of the innerlayer copper to all outlines/edges must be at least 400 µ.
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