... areas may result. | 10. NON-PLATED HOLES | PRINTED CIRCUIT BOARDS | 10.1 This refers to plated through PCBs: If we do not have | PRINTED WIRING BOARDS PROTOTYPING | any information from you as to which holes are to be plated-through and which are not, we will determine this to the best of our | PRINTED WIRING BOARDS PROTOTYPING | knowledge. 10.2 If non-plated holes are positioned in a pad, this pad must be bigger than the hole by at least factor 1.5. Otherwise some | PRINTED WIRING BOARDS PROTOTYPING | or all of the pads may be removed. | 11. DATA PROVIDED (DATA INCONSISTENCY) | 11.1 If drilling and measurement plans are included that do | PRINTED WIRING BOARDS PROTOTYPING | not match the drilling program or the contour according to the gerber-data, then the drilling program and the gerber-data will be binding in all cases. | PRINTED WIRING BOARDS PROTOTYPING | | 12. PCB CONTOUR | 12.1 If not otherwise stipulated, the PCB contour will be determined by the centre (=centre vector) of the contour lines | PRINTED WIRING BOARDS PROTOTYPING | provided in the order data. If Slots are represented by you by rectangular outlines, then we assume generally that the corner radius is contained. | | PRINTED WIRING BOARDS PROTOTYPING | 13. TECHNICAL ...
[ Printed Wiring Boards Prototyping ]


... (SnCuNi und SnAgCu)! The nearer the deadline draws to the compulsory implementation of lead-free regulations (ROHS), the greater the attempts to achieve lead-free solutions | PRINTED WIRING BOARDS PROTOTYPING | that are comparable to the “all-purpose answer” SnPb in terms of technology and cost. Two systems are particularly predominant: tin/silver/copper (SnAgCu) and, more recently, stabilised | PRINTED WIRING BOARDS PROTOTYPING | tin/copper (SnCuNi). Although the level of efficiency of both systems is not yet completely clear, the following presents the latest information: SnAgCu There is more | PRINTED WIRING BOARDS PROTOTYPING | experience in the field of silver systems. Here, differentiation is made between the Sn-3.5Ag-0.7Cu, Sn-4Ag-0.5Cu and Sn-3Ag- 0.5Cu systems which vary in use from continent | PRINTED WIRING BOARDS PROTOTYPING | to continent. However, the agreed expert opinion (IPC/Soldertech-Conference Brussels 2003) is that the technological differences between the three systems are negligible. Sn-3.5Ag- 0.7Cu is the | PRINTED WIRING BOARDS PROTOTYPING | most common alloy in Europe. SnCuNi Although there are even fewer field results for the stabilised ...
[ Printed Wiring Boards Prototyping ]


... = Double Sided | PTH = Plated Through Hole | NPTH = Non Plated Through Hole | MLBs = Multilayer Boards up to 12 | PRINTED WIRING BOARDS PROTOTYPING | Layers | HDI = High Density Interconnection - With Buried Vias | Blind Vias | Embedded Passive Components | Impedance Control - In Fine-Line | | PRINTED WIRING BOARDS PROTOTYPING | Micro-Fine- Line | HDI-Technology | Forming Microvias in Laser- ITechnology - In Rapid Proto-Typing | In Medium to High Volume | In Rapid Mass-Production (high- | PRINTED WIRING BOARDS PROTOTYPING | Ispeed/high volume) - Specifications in DIN | in MIL | in IPC | In UL-Approval listed under File No.:96892 - In SMOBC Circuitry | Bare | PRINTED WIRING BOARDS PROTOTYPING | copper with LPI Solder Mask | OSP - Organic Surface IProtection - In HAL - Hot Air Leveling also RoHS- Compliant (Lead-free) - Gold Fingers-, | PRINTED WIRING BOARDS PROTOTYPING | Tabs-, or Body Plating | Nickel & Immersion Gold (NiPAu) | Immersion ITin Protection | Immersion Silver = Imm Ag | OSP (Organic Surface Protection) | PRINTED WIRING BOARDS PROTOTYPING | - Legend & Special Screen Printing | Carbon Ink | Peelable Ink - Profile in Routing | V-Scoring | Punching | Cutting | and Milling | PRINTED WIRING BOARDS PROTOTYPING | - With Electrical ...
[ Printed Wiring Boards Prototyping ]