... - Management - Guidelinses Tolerances may not longer be instruments of the legalization of comfort results. Tolerances must be regarded rather as unwanted function | PRINTED WIRING BOARDS FAB | loss, which have to avoid or to limit. | IN ORDER TO ACHIEVE THIS GOAL |, not only the control of the own production processes | PRINTED WIRING BOARDS FAB | is necessary, also as a starting point of the manufacturing is the procurement of qualitatively perfect products of our suppliers. Therefore obligate our suppliers to | PRINTED WIRING BOARDS FAB | be able to manufacture in application of our consistent quality philosophy and in definition of methodology and realization provably the correct quality. For this among | PRINTED WIRING BOARDS FAB | other things counts the obligation of our suppliers to attach to each supply a test certificate. This demand is a component of our quality management | PRINTED WIRING BOARDS FAB | system and we evaluate and control it continuously with an evaluation procedure. Beyond that the examinations are regulated in our house by employment regulations in | PRINTED WIRING BOARDS FAB | the inspection of incoming goods. - In the case of | ...
[ Printed Wiring Boards Fab ]


... CIRCUIT BOARDS | | LAND | A portion of a conductive pattern usually, but not exclusively, used for the connection and / or attachment | PRINTED WIRING BOARDS FAB | of components. Also called Pad, Boss, Terminal Point, Tab, Spot or Donut. | LANDLESS HOLE | A plated-through hole without a land(s). | LASER VIAS | PRINTED WIRING BOARDS FAB | | Are partial vias which are produced by a laser. They may connect two adjacent layers. Through-vias cannot be produced with this technique. | LAYER-TO-LAYER | PRINTED WIRING BOARDS FAB | SPACING | The thickness of dielectric material between adjacent layers of conductive circuitry. | LAY-UP | The technique of registering and stacking layers of a | PRINTED WIRING BOARDS FAB | multilayer board before the laminating cycle. | LIQUID FILM PHOTO-SENSITIVE | laquer applied to the board by screen printing, curtain coating, or spraying. Afterwards, the | PRINTED WIRING BOARDS FAB | laquer is cured sufficiently for the solder mask pattern to be photo-transferred to it before the unexposed parts are removed through a developing ...
[ Printed Wiring Boards Fab ]


... layers for fabricators. The solution here is a fabrication analysis tool that can handle such issues as clearances, coverage, webbing, and so forth. For | PRINTED WIRING BOARDS FAB | instance, most fab shops want the largest possible clearances in a solder layer so that mask doesn't end up on pads. On the flip side, | PRINTED WIRING BOARDS FAB | copper is not supposed to be exposed. The two requirements - no mask on pads and unwanted exposed copper - must be balanced. It is | PRINTED WIRING BOARDS FAB | not easy to do. How can the designer help? Devise a standardized clearance, or set the clearances at 1:1, and let the shop do the | PRINTED WIRING BOARDS FAB | soldermask enhancement. Here's another issue: the soldermask webbing between pads on fine-pitch surface mount devices. Most masks can go to 0.003" without the resist flaking | PRINTED WIRING BOARDS FAB | off. However, if the pads are so tightly grouped that the dams between them are less than 0.003", it's better to construct a mask opening | PRINTED WIRING BOARDS FAB | over the entire group. That will make the fabricator's life much simpler. Bear in mind that a fabricator's spacing tolerances ...
[ Printed Wiring Boards Fab ]