... organic coating of copper ENTEK PLUS Cu - 106 5.8 Text printing, additional printing techniques Silk screen printing Standard µ Special µ Technical limit | PRINTED CIRCUIT BOARDS TECHNOLOGIES | µ Silk screen to Pads spacing 300 250 200 Silk screen to PTH spacing 300 250 200 Line width 200 175 140 Minimum size of | PRINTED CIRCUIT BOARDS TECHNOLOGIES | letters 1250 1000 800 Carbon key pad printing Standard (µ) Special (µ) Technical limit (µ) Track to track spacing 500 400 400 Minimum track width | PRINTED CIRCUIT BOARDS TECHNOLOGIES | 500 400 300 Peelable mask Standard Special Technical limit Max diameter of covered holes 1,8 mm 2,0 mm 2,6*mm Thickness of peelable mask 300µ 400µ | PRINTED CIRCUIT BOARDS TECHNOLOGIES | 500µ *coverage cannot be guaranteed 5.9 Contour machining Contouring is performed by three possible techniques: * Routing * V-cutting These techniques allow contouring within the | PRINTED CIRCUIT BOARDS TECHNOLOGIES | standard „DIN 7168 mittel“ (medium accuracy) and „fein“ (precise accuracy). Dependant on the size of the board following tolerances are given: Board size: fine middle | PRINTED CIRCUIT BOARDS TECHNOLOGIES | 0,5 mm up to 6 mm +/- 0,05 mm +/- 0,10 mm 6 mm up to 30 mm +/- 0,10 mm +/- 0,20 ...
[ Printed Circuit Boards Technologies ]


... TERMS OF PRINTED CIRCUIT BOARDS | | REFLOWING | The melting of an electrodeposit followed by solidification. The surface has the appearance and physical | PRINTED CIRCUIT BOARDS TECHNOLOGIES | characteristics of being hot dipped. | REGISTRATION | The degree of conformity of the position of a pattern, or a portion thereof, with its intended | PRINTED CIRCUIT BOARDS TECHNOLOGIES | position or with that of any other conductor layer of a board. | RESIN EPOXY-MATERIAL | used for impregnating glass weave. | RESIN | Recession | PRINTED CIRCUIT BOARDS TECHNOLOGIES | The presence of voids between the barrel of the plated-through hole and the wall of the hole, seen in microsections of plated-through holes in boards | PRINTED CIRCUIT BOARDS TECHNOLOGIES | exposed to high temperatures. | RESIN SMEAR | Resin transferred from the base material onto the surface or edge of the conductive pattern normally caused | PRINTED CIRCUIT BOARDS TECHNOLOGIES | by drilling. Sometimes called Epoxy Smear. | RESIST COATING MATERIAL | used to mask or to protect selected areas of a pattern from the action | PRINTED CIRCUIT BOARDS TECHNOLOGIES | of an etchant solder, or plating. | RING VOIDS | The absence of substance in a localized area, as an ...
[ Printed Circuit Boards Technologies ]


... of lead-free regulations (ROHS), the greater the attempts to achieve lead-free solutions that are comparable to the “all-purpose answer” SnPb in terms of technology | PRINTED CIRCUIT BOARDS TECHNOLOGIES | and cost. Two systems are particularly predominant: tin/silver/copper (SnAgCu) and, more recently, stabilised tin/copper (SnCuNi). Although the level of efficiency of both systems is not | PRINTED CIRCUIT BOARDS TECHNOLOGIES | yet completely clear, the following presents the latest information: SnAgCu There is more experience in the field of silver systems. Here, differentiation is made between | PRINTED CIRCUIT BOARDS TECHNOLOGIES | the Sn-3.5Ag-0.7Cu, Sn-4Ag-0.5Cu and Sn-3Ag- 0.5Cu systems which vary in use from continent to continent. However, the agreed expert opinion (IPC/Soldertech-Conference Brussels 2003) is that | PRINTED CIRCUIT BOARDS TECHNOLOGIES | the technological differences between the three systems are negligible. Sn-3.5Ag-0.7Cu is the most common alloy in Europe. SnCuNi Although there are even fewer field results | PRINTED CIRCUIT BOARDS TECHNOLOGIES | for the stabilised tin/copper system Sn-0.7Cu- 0.1Ni, it shows a lot of potential. It is called ...
[ Printed Circuit Boards Technologies ]