... Nickel Immersion Gold | — ENIG — | (Electroless Nickel Immersion Gold) Precious and refined by Immersion nickel gold process has long been an | PRINTED CIRCUIT BOARDS PRODUCTION | established surface refining process among printed circuit board techniques. Application areas However, in spite of many advantages over conventional solder levelling it has only been | PRINTED CIRCUIT BOARDS PRODUCTION | adopted for certain application areas. Nickel gold is utilized in particular where PCB surfaces are exposed to aggressive environments, for instance in mobile phones, or | PRINTED CIRCUIT BOARDS PRODUCTION | automobile electronics. Due to the consistent chemical precipitation of metal, gold is the obvious choice for all fine-pitch assemblings with under 0,5 mm grid spaces. | PRINTED CIRCUIT BOARDS PRODUCTION | Due to its smooth excellence, the immersion nickel gold surface is a better alternative to HAL, particularly for narrow SMD grids on both side of | PRINTED CIRCUIT BOARDS PRODUCTION | PCB`s. The actual wiring of a component is effected by means of a 4-6 my thick layer of nickel, and not by means of the | PRINTED CIRCUIT BOARDS PRODUCTION | extremely fine 0,05 to 0,2 my layer of gold which merely ...
[ Printed Circuit Boards Production ]


... the order and the complete production data are made available not later than 6 p.m., does not count as a working day. If the | PRINTED CIRCUIT BOARDS PRODUCTION | order and/or the production data are made available after 6 p.m., the first working day is t he day after next. 1.2 Technical preconditions: Productions | PRINTED CIRCUIT BOARDS PRODUCTION | data and orders which are faulty, incomplete, or vary from the details on which the offer is based lead to delays in delivery and/or incorrect | PRINTED CIRCUIT BOARDS PRODUCTION | execution of the order, etc. | 2. LIABILITY DISCLAIMER | 2.1 We do not accept responsibility for any errors incurred when referring to offers or | PRINTED CIRCUIT BOARDS PRODUCTION | when enquiring. | 3. CORRECT SIDE | PRINTED CIRCUIT BOARDS | 3.1 In order to be able to recognise the correct side (mirrored or unmirrored | PRINTED CIRCUIT BOARDS PRODUCTION | image) legible type must be visible in an external position on the conductive pattern. 3.2 The order of layer construction must be given for multilayers. | PRINTED CIRCUIT BOARDS PRODUCTION | We are not liable for correct execution if we are not provided with this information. | 4. CONFUSION | We cannot accept liability for ...
[ Printed Circuit Boards Production ]


... IMAGES To help you quickly access the services we offer, the following is a guide to the preferred requirements for producing quality Printed Circuit | PRINTED CIRCUIT BOARDS PRODUCTION | Boards. Can be supplied as artworks, penplots, photoplots or photoplot files, so long as the quality and registration of the images is of a standard | PRINTED CIRCUIT BOARDS PRODUCTION | that will enable a good quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These | PRINTED CIRCUIT BOARDS PRODUCTION | marks could be the board reference so long as it cannot be read from the other side. (This is for your protection to prevent the | PRINTED CIRCUIT BOARDS PRODUCTION | boards made inside out). Images should comply with design rules that will result in a board that will meet performance and cost requirements. ARTWORKS Scale | PRINTED CIRCUIT BOARDS PRODUCTION | must be given, tapes securely stuck to the backing sheet, track to pad & track to track joints complete and the backing sheet clean. PENPLOTS | PRINTED CIRCUIT BOARDS PRODUCTION | Scale must be given and be at least 2:1. Plots must also offer sharp edge definition and traces dense enough ...
[ Printed Circuit Boards Production ]