Printed Circuit Boards Plant Circuit Boards Prototypes in many different shapes and types.

... microvias, while photothermal ablation creates more debris in and around the microvia that must be removed. However, the debris is non-tenacious and is easily | PRINTED CIRCUIT BOARDS PLANT | removed by conventional cleaning techniques such as permangate desmear. Regardless of the ablation mechanism, high peak powers and short laser pulses give the best microvia | PRINTED CIRCUIT BOARDS PLANT | results. Each material has a unique ablation threshold, above which vaporization occurs for a given wavelength and laser fluence (energy/area). | MOST LASER-BASED SYSTEMS | | PRINTED CIRCUIT BOARDS PLANT | are typically configured for direct microvia formation, which means that each microvia is drilled one at a time at high speed. With this technique, the | PRINTED CIRCUIT BOARDS PLANT | size of the focused laser beam usually defines the size of the microvia or the drilling speed or both. UV lasers often produce the smallest | PRINTED CIRCUIT BOARDS PLANT | focal spots (5 to 20 microns in diameter), and when used to form larger vias, the laser beam can either be expanded or trepanned to | PRINTED CIRCUIT BOARDS PLANT | accommodate the larger diameter. With trepanning, the laser beam ...
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... the versatile system yields total process cost reduction Panel Plating a Flash of Copper The panels are online in a wet state transferred to | PRINTED CIRCUIT BOARDS PLANT | our automatic electrolytic copper plating lines to get a flasch of copper.. The panels are attached to plating racks. When the racks are moved to | PRINTED CIRCUIT BOARDS PLANT | the loading station, the system computer instructs the hoist to pick up the rack and begin the plating cycle. The copper plating time is approximately | PRINTED CIRCUIT BOARDS PLANT | one hour. Electrolytic copper of minimum thickness 12 microns is deposited on the surface of the panel and on the walls of the drilled holes. | PRINTED CIRCUIT BOARDS PLANT | This is achieved by applying an electric current to a cell comprising the panel (the cathode) and a set of copper bars (the anodes) suspended | PRINTED CIRCUIT BOARDS PLANT | in a conducting medium (the electrolyte). A plating history log is maintained on the shop floor control computer which assists the operator in making minor | PRINTED CIRCUIT BOARDS PLANT | adjustments to the plating current. Finally, the panels are rinsed and returned to the unload station. Sample ...
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... and lower for each dielectric layer. A CO2 laser can be used along with the UV DPSS in a dual-laser setup that combines the | PRINTED CIRCUIT BOARDS PLANT | ablation speed of CO2 on dielectric materials with the ability of UV DPSS to ablate copper. This procedure obviates the need for precise fluence control | PRINTED CIRCUIT BOARDS PLANT | of a single UV DPSS laser and capitalizes on the selective ablation thresholds of different materials at different wavelengths. The dual-laser approach therefore boosts panel | PRINTED CIRCUIT BOARDS PLANT | throughput by exploiting the advantages of both lasers and circumventing their limitations. Moreover, the dual-laser technique, like the other laser processes, requires only a single | PRINTED CIRCUIT BOARDS PLANT | panel run to complete all steps of microvia formation. The dual-laser technique illustrates the versatility of CO2 and UV DPSS lasers for high-volume microvia formation | PRINTED CIRCUIT BOARDS PLANT | over a broad range of materials and operating conditions. In fact, their adaptability has helped to establish these two laser types as industry workhorses in | PRINTED CIRCUIT BOARDS PLANT | applications from ...
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