... as the chemical baths call for a great deal of analysis and supervision due to the narrow processing slit. The process of solder mask | PRINTED CIRCUIT BOARDS FABRICATORS | coating as well as de- oxidation of bare copper surfaces (activation) must perfectly match the gold plating. To prevent the risk of poor metallic deposition on | PRINTED CIRCUIT BOARDS FABRICATORS | the gold surface, vias must be completely free of solder mask coating or be completely closed by means of a special filling process. Curing of | PRINTED CIRCUIT BOARDS FABRICATORS | the solder mask coating must also concur with that of the chemical gold plating as it is exposed to hydrogen in the 90° C nickel | PRINTED CIRCUIT BOARDS FABRICATORS | baths. One has the choice between an expensive coating system or a subsequent infrared solidification which, in turn, also calls for further investment in facilities. | PRINTED CIRCUIT BOARDS FABRICATORS | THE POTENTIAL For a lead free altenative provided the PCB manufacturer ensures optimal conditions for immersion nickel gold coating, the results of wave soldering are | PRINTED CIRCUIT BOARDS FABRICATORS | equally good to solder levelling. Good storage ability is also achieved by covering the ...
[ Printed Circuit Boards Fabricators ]... the described problems: A.2 1 ) | STORAGE CONDITIONS PCB`S | should be stored in heated and dry rooms. Constant low humidity is necessary | PRINTED CIRCUIT BOARDS FABRICATORS | before the soldering processes start. A rapid fall in temperature of more than 7 degrees causes condensation on the stored PCB`s. Humidity should never exceed | PRINTED CIRCUIT BOARDS FABRICATORS | 65 %. The package must be kept intact although the polyethylene packages capability of keeping humidity away is not really reliable. A.3 2 ) Storage | PRINTED CIRCUIT BOARDS FABRICATORS | time The storage time of | PCB`S | should be as short as possible. PCB`s should be taken out due to the „first-in, first out“ | PRINTED CIRCUIT BOARDS FABRICATORS | rule. The the polyethylene packages should be taken away just before the assembling. Remaining PCB`s should be repacked again. To avoid exposure to draught, the | PRINTED CIRCUIT BOARDS FABRICATORS | packages should be stored in boxes. A.4 3 ) | SOLDERING TESTS PCB`S | stored for over several months and being transported under questionable conditions, | PRINTED CIRCUIT BOARDS FABRICATORS | should be submitted again to a soldering test, being equivalent to your soldering process. A.5 4 ) Heat ...
[ Printed Circuit Boards Fabricators ]... 0.006 250 0.010 17 0.65 DS 50.8 2000 288 20 130 V-0 All + SS-Single sided, DS-Double or single sided Marking Company name, "MIC" | PRINTED CIRCUIT BOARDS FABRICATORS | or trademark and type designation may be followed by suffix to denote factory indentification or buring test classification. See General Information Preceeding These Recognitions A | PRINTED CIRCUIT BOARDS FABRICATORS | (black triangle ) Symbol is marked on those products within a given type designation that comply with direct support of current-carrying parts performance level require-ments | PRINTED CIRCUIT BOARDS FABRICATORS | of UL 796. "All" is used to indicate that all base materials under that type designation comply with direct support of current-carrying parts performance level | PRINTED CIRCUIT BOARDS FABRICATORS | requirements of UL 796. For use only in equipment where the acceptability of the combination is determined by Underwriter Laboratories Inc. Explanations concerning the UL | PRINTED CIRCUIT BOARDS FABRICATORS | certification Clad Cond Width Min The minimum conductor width is 150 µm, except the distance of the track to the outer contour is smaller than | PRINTED CIRCUIT BOARDS FABRICATORS | 400 µm. Clad Cond Width Min Edge If ...
[ Printed Circuit Boards Fabricators ]