... Production-proven in both vertical and horizontal process equipment, the versatile system yields total process cost reduction Panel Plating a Flash of Copper The panels | PCB PRODUCER | are online in a wet state transferred to our automatic electrolytic copper plating lines to get a flasch of copper.. The panels are attached to | PCB PRODUCER | plating racks. When the racks are moved to the loading station, the system computer instructs the hoist to pick up the rack and begin the | PCB PRODUCER | plating cycle. The copper plating time is approximately one hour. Electrolytic copper of minimum thickness 12 microns is deposited on the surface of the panel | PCB PRODUCER | and on the walls of the drilled holes. This is achieved by applying an electric current to a cell comprising the panel (the cathode) and | PCB PRODUCER | a set of copper bars (the anodes) suspended in a conducting medium (the electrolyte). A plating history log is maintained on the shop floor control | PCB PRODUCER | computer which assists the operator in making minor adjustments to the plating current. ...
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... in the foreground. Today all possible products, materials, constructions and systems are tested and evaluated regarding their electrical danger as well as their danger | PCB PRODUCER | of accident and fire. And in addition there were examined alarm systems and the ability to discover, control and prevent fire. | UL DEVELOPS SAFETY | PCB PRODUCER | | regulations, which are taken over frequently as ANSI standards. Underwriters Laboratories certify and register customers according to ISO 9000. More... | PRINTED CIRCUIT BOARDS | PCB PRODUCER | | | RAPID MASS PRODUCTION (RMP |) is a new and unique express service for large and medium-sized series ( 3 to 30 qm production | PCB PRODUCER | size). The manufacture of multi-layers takes only 9 working days and double-sided pressings only 7 ! ( Minimum charge: 10% of order value). So far, | PCB PRODUCER | express services have been mostly in the realm of prototype manufacturers, but RMP is on offer to all customers who recognise the market opportunities resulting | PCB PRODUCER | from accelerated product launches or speedier ...
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... Standard (µ) Special (µ) Technical limit (µ) Annular oversize of Pads 90 70 50 Minimum (mask) bridge width 120 100 75 Min. SMD to | PCB PRODUCER | SMD spacing* 300 240 175 * Minimum spacing between Pads or SMD`s`s required to print a solder mask bridge 5.7 Metallic finishing techniques Thickness characteristics | PCB PRODUCER | Electrolytic copper 20µ - 25µ depends on exposure time Hot air leveling 2µ – 20µ 37 % lead/63 % tin Electrolytic nickel/gold* 1µ – 3µ | PCB PRODUCER | gold up to 5µ nickel Immersion nickel/ (flash) gold* 0,05µ – 0,1µ gold up to 5µ nickel Immersion nickel/ (bond) gold* 0,3µ gold up to | PCB PRODUCER | 5µ nickel Immersion chemical tin* 1µ very high planarity Organic surface protection (OSP) organic coating of copper ENTEK PLUS Cu - 106 5.8 Text printing, | PCB PRODUCER | additional printing techniques Silk screen printing Standard µ Special µ Technical limit µ Silk screen to Pads spacing 300 250 200 Silk screen to PTH | PCB PRODUCER | spacing 300 250 200 Line width 200 175 140 Minimum size of letters 1250 1000 800 Carbon key pad printing Standard (µ) ...
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