Pcb Industry Different PCBs of the same materials and surface structure.

... GLOSSARY > TERMINOLOGY AND TERMS OF PRINTED CIRCUIT BOARDS | | INFRARED (IR) | Part of the electromagnetic spectrum between the visible light range | PCB INDUSTRY | and the radar range. | INFRARED FUSING | The melting of tin / lead plating on PCB's using the energy given off by infrared waves | PCB INDUSTRY | | INSULATION RESISTANCE | The electrical resistance of the insulating material between any pair of contacts, conductors, or grounding devices in various combinations. | INSULATION | PCB INDUSTRY | METAL SUBSTRATES (IMS) |  Insulated metal substrates (IMS), thermal substrates, SMI or Alep Twin - there are many names for special PCB´s that were developed | PCB INDUSTRY | for one main purpose: to draw the undesired heat from electric components off the circuit board at a reasonable cost and, if possible, saving space. | PCB INDUSTRY | | INTERFACIAL CONNECTION | A conductor which connects conductive patterns on opposite sided of a PCB or other base. | INTERNAL LAYER (INNERLAYER) | A | PCB INDUSTRY | conductive pattern contained entirely within a multilayer PCB | IMIDAZOL |Chemical ...
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... TIN – ETERNAL PRINTED CIRCUIT BOARD FAVOURITE | The procurement of PCBs often leads to the question as to which surface protection is the | PCB INDUSTRY | right one. This is partly due to the changing technical demands on PCBs in further processing. Also, as of 1. 6. 2006, EU-Regulations restricting the | PCB INDUSTRY | use of dangerous materials in electronic appliances are to include the prohibition of materials containing lead, and is, therefore, another reason why alternative surfaces have | PCB INDUSTRY | been developed. One of these is immersion tin. PROCEDURE A layer of tin is applied to the PCB by means of a special process, in | PCB INDUSTRY | which the copper atoms of the exposed conductors and contact areas are exchanged for tin atoms by adding thiourea. The chemical reaction ends when the | PCB INDUSTRY | copper surface is 0,6 to 1,2 my. Between the tin and copper layers there is an inter- metallic copper-tin phase after this process, i.e. blended | PCB INDUSTRY | metal. There are a number of reasons in favour of applying tin chemically. One advantage is the uniform ...
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... destroying the board. | THIEF | A racking device used in the electroplating process to provide a more uniform current density on plated parts. | PCB INDUSTRY | | THIXOTROPY: |Property of a material to reduce its viscosity under mechanical influence / shearing stress by means of pumping, stirring, squeegee pressure and to | PCB INDUSTRY | return to its original conditions after the stress has finished. Screen- printing inks, for instance, have a very high thixotropy. On account of the squeegee | PCB INDUSTRY | pressure and the movement the screen-printing ink becomes thinner and thus flows through the screen meshes onto the substrate to be coated. After lifting-off of | PCB INDUSTRY | the screen/stencil the ink must "stand"; it has to achieve its original condition rapidly and must not flow anymore, which ensures a good edge coverage. | PCB INDUSTRY | | TRACK / GAP: | Technical expression describing the minimum of conductor width (track or trace)  and the minimum Insulation width (gap) between two of | PCB INDUSTRY | them on a printed circuit board. Track/gap helps to define the ...
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