Multilayer Circuits Technologies Part of the electromagnetic spectrum between the visible light range and the radar range.

... CIRCUIT BOARD FAVOURITE | The procurement of PCBs often leads to the question as to which surface protection is the right one. This is | MULTILAYER CIRCUITS TECHNOLOGIES | partly due to the changing technical demands on PCBs in further processing. Also, as of 1. 6. 2006, EU-Regulations restricting the use of dangerous materials | MULTILAYER CIRCUITS TECHNOLOGIES | in electronic appliances are to include the prohibition of materials containing lead, and is, therefore, another reason why alternative surfaces have been developed. One of | MULTILAYER CIRCUITS TECHNOLOGIES | these is immersion tin. PROCEDURE A layer of tin is applied to the PCB by means of a special process, in which the copper atoms | MULTILAYER CIRCUITS TECHNOLOGIES | of the exposed conductors and contact areas are exchanged for tin atoms by adding thiourea. The chemical reaction ends when the copper surface is 0,6 | MULTILAYER CIRCUITS TECHNOLOGIES | to 1,2 my. Between the tin and copper layers there is an inter- metallic copper-tin phase after this process, i.e. blended metal. There are a | MULTILAYER CIRCUITS TECHNOLOGIES | number of reasons in favour of applying tin chemically. One advantage is the uniform smoothness of the ...
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... AND TERMS OF PRINTED CIRCUIT BOARDS | | HOLE BREAKOUT | A condition in which a hole is not completely surrounded by the land. | MULTILAYER CIRCUITS TECHNOLOGIES | | HOLE DENSITY | The quantity of holes in a printed board per unit area. | HOLE LOCATION | - The dimensional location of the | MULTILAYER CIRCUITS TECHNOLOGIES | center of a hole. | HOLE PATTERN | The arrangement of all holes in a printed board. | HOLE PREPARATION | The hole prior to | MULTILAYER CIRCUITS TECHNOLOGIES | plating shall be clean cut and free of burrs, loose or hanging fibers, copper dust and resin dust. | HOLE PULL STRENGTH | The force | MULTILAYER CIRCUITS TECHNOLOGIES | (in pounds) necessary to rupture a plated-through hole when loaded or pulled in the direction of the axis of the hole. | HOLE |Void A | MULTILAYER CIRCUITS TECHNOLOGIES | void in the metallic deposit of a plated-through ...
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... urge to highest perfection we are situated in a market position, allowing us to compete with the best in quality, efficiency and punctuality. | | MULTILAYER CIRCUITS TECHNOLOGIES | ABOUT 500 COMPANIES OF ELECTRONIC |, automobile industry and telecommuncation benefit from the quality of our products, services and cost efficiency - produced and done | MULTILAYER CIRCUITS TECHNOLOGIES | by our 100 employees. On the company`s plant of 25.000 sqm we are able to produce 3.000 sqm of single-sided, 8000 sqm double-sided PCBs and | MULTILAYER CIRCUITS TECHNOLOGIES | 5000 sqm Multilayer per month. | "TIME TO MARKET" | Especially during the last few years we succeeded in realizing new sophisticated concepts of automatisation, | MULTILAYER CIRCUITS TECHNOLOGIES | flexibility and other improvements in production techniques. Therefore we are able to offer state-of- the-art quality for a rate beating world market prices. As in | MULTILAYER CIRCUITS TECHNOLOGIES | times of radical cuts in the "time-to-market" | PRINTED CIRCUIT BOARDS | cyclus, our high-speed/high volume production enables you to be one step ahead in | MULTILAYER CIRCUITS TECHNOLOGIES | your product launch. Moreover excellent preparation at ...
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