Multilayer Circuits Production Rigid | Flexible | Flex-Rigid | Low Density | Hight Density Interconnect Carriers (HDI).

... is an efficient use of the given spaec on our production panel. Especially in times of raising prices in the laminate sector, the question | MULTILAYER CIRCUITS PRODUCTION | how to arrange your PCB`s on our production panel is getting more and more essential. Therefore the size, shape and the width of the dummy | MULTILAYER CIRCUITS PRODUCTION | areas of your pcb can have an important influence on the price-building process. In each case - unfunctional "extravagancy" or dummy areas, dominated by vast | MULTILAYER CIRCUITS PRODUCTION | registration holes - we will contact you to minimize unnecessary costs. | V-CUTTING | The V-cutting process is the most space-saving mechanical separation process. As | MULTILAYER CIRCUITS PRODUCTION | pcb`s can be arranged on the panel one by one in "zero-spaces", this process helps to save you money at high-volume orders. (more than 1000 | MULTILAYER CIRCUITS PRODUCTION | Eurocards). One disadvantage is that this process sometimes is not accepted when very high standards concerning flammability are required. And this process does not allow | MULTILAYER CIRCUITS PRODUCTION | the shaping of round PCB`s, notches and corners. | ROUTING CIRCLES, NOTCHES, ...
[ Multilayer Circuits Production ]


... | Technical Terms of Delivery | 1. WORKING DAYS | 1.1 The day, on which the order and the complete production data are made | MULTILAYER CIRCUITS PRODUCTION | available not later than 6 p.m., does not count as a working day. If the order and/or the production data are made available after 6 | MULTILAYER CIRCUITS PRODUCTION | p.m., the first working day is t he day after next. 1.2 Technical preconditions: Productions data and orders which are faulty, incomplete, or vary from | MULTILAYER CIRCUITS PRODUCTION | the details on which the offer is based lead to delays in delivery and/or incorrect execution of the order, etc. | 2. LIABILITY DISCLAIMER | | MULTILAYER CIRCUITS PRODUCTION | 2.1 We do not accept responsibility for any errors incurred when referring to offers or when enquiring. | 3. CORRECT SIDE | PRINTED CIRCUIT BOARDS | MULTILAYER CIRCUITS PRODUCTION | | 3.1 In order to be able to recognise the correct side (mirrored or unmirrored image) legible type must be visible in an external position | MULTILAYER CIRCUITS PRODUCTION | on the conductive pattern. 3.2 The order of layer construction must be given for multilayers. We are not liable for correct execution if we are | MULTILAYER CIRCUITS PRODUCTION | not provided ...
[ Multilayer Circuits Production ]


... Adhesion and Through-Hole Coverage Horizontal and Vertical Process Compatibility No Hole Size, MLB Layer Count or Aspect Ratio Limitations Suitable for PTH Innerlayer or | MULTILAYER CIRCUITS PRODUCTION | Microvia Metallization CHARACTERISTICS: - excellent copper to copper adhesion - no additional etching will be necessary for copper-cleaning - no residuals in blind-micro-Via´s The DMS-E | MULTILAYER CIRCUITS PRODUCTION | direct metallization system selectively deposits highly conductive polymer on dielectric resin and glass areas without the use of electroless copper. The formaldehyde-free, environmentally sound technology | MULTILAYER CIRCUITS PRODUCTION | provides fast and uniform coverage of the plated through-hole. DMS-E selective catalyzation ensures excellent copper-to-copper adhesion at the innerlayer junctions on multilayers. Innerlayer and outerlayer | MULTILAYER CIRCUITS PRODUCTION | copper surfaces remain pristine, eliminating the potential for interconnect defects and copper- to-copper adhesion failure. Costly waste treatment and microetch post-treatments are not required. Fully | MULTILAYER CIRCUITS PRODUCTION | compatible with ...
[ Multilayer Circuits Production ]