... tests in the UL laboratories and they existed even the extremely heavy 130 C° long term test. That qualifies us without reservation for the | MULTILAYER CIRCUITS PRODUCER | US-American and Canadian safety standards. Down you see our "Yellow Card" shown with the valid parameters for a UL marking.     A (black triangle ) Symbol | MULTILAYER CIRCUITS PRODUCER | is marked on those products within a given type designation that comply with direct support of current-carrying parts performance level requirements of UL 796. "All" | MULTILAYER CIRCUITS PRODUCER | is used to indicate that all base materials under that type designation comply with direct support of current-carrying parts performance level requirements of UL 796 | MULTILAYER CIRCUITS PRODUCER |     For use only in equipment where the acceptability of the combination is determined by Underwriter Laboratories Inc. Explanations concerning the UL certification Clad Cond Width | MULTILAYER CIRCUITS PRODUCER | Min The minimum conductor width is 150 µm, except the distance of the track to the outer contour is smaller than 400 µm. Clad Cond | MULTILAYER CIRCUITS PRODUCER | Width Min Edge If the distance between the track and ...
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... of the directive 2002/95/EC of the European Parliament – The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).” | MULTILAYER CIRCUITS PRODUCER | | SURFACE PRINTING | > How largely may a drilling or a milling be, in order to be able to overprint it with a peelable | MULTILAYER CIRCUITS PRODUCER | solder resist ? Drillings (diameter) smaller 1.80 mm or milling (area) smaller 1.80 mm x 1.80 mm can be overprinted process-reliable. Drillings of 1.80 mm | MULTILAYER CIRCUITS PRODUCER | up to 2.60 mm can also be overprinted, however without a result warranty, because some drillings of this size can remain sporadically open. The reason | MULTILAYER CIRCUITS PRODUCER | is that on the one hand the lacquer does not have a sufficient viscosity and during the printing process it would run through the hole, | MULTILAYER CIRCUITS PRODUCER | and on the other hand the in- printed peelable solder resist produces such a high adhesion in the drillings or milling, so that the mask | MULTILAYER CIRCUITS PRODUCER | tears when you are later taking it off; i.e. the peelable solder resist remains in the drilling or milling and has to be ...
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... in the final metallization being copper with no other protective metal but the non soldered areas are coated by a solder resist, exposing only | MULTILAYER CIRCUITS PRODUCER | the component terminal areas. | SOLDER LEVELING |The process of dipping PCB's into hot liquids, or exposing them to liquid waves to achieve fusion. First, | MULTILAYER CIRCUITS PRODUCER | flux is applied to the board by dipping or brushing. Then the board is preheated in a liquid (maintained at 250 F). Next, the board | MULTILAYER CIRCUITS PRODUCER | is immersed in fusing liquid at 430 - 500 F. Finally, it is dipped in another 250 F liquid to cool it and reduce thermal | MULTILAYER CIRCUITS PRODUCER | shock. Thin fused coatings can be applied. | SOLDER RESISTS (SOLDERMASK) | Coatings which mask off and surface insulate those areas of a circuit where | MULTILAYER CIRCUITS PRODUCER | soldering is not desired. | STEP AND REPEAT | A method by which successive exposures of a single image are made to produce a Multiple | MULTILAYER CIRCUITS PRODUCER | Image Production Master. | SUB-PANEL | A group of printed circuits (called modules) arrayed in a panel and handled by both the board house and | MULTILAYER CIRCUITS PRODUCER | the assembly ...
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