... and measurement plans are included that do not match the drilling program or the contour according to the gerber-data, then the drilling program and | MULTILAYER CIRCUITS MANUFACTURING | the gerber-data will be binding in all cases. | 12. PCB CONTOUR | 12.1 If not otherwise stipulated, the PCB contour will be determined by | MULTILAYER CIRCUITS MANUFACTURING | the centre (=centre vector) of the contour lines provided in the order data. If Slots are represented by you by rectangular outlines, then we assume | MULTILAYER CIRCUITS MANUFACTURING | generally that the corner radius is contained. | 13. TECHNICAL SPECIFICATIONS | PRINTED CIRCUIT BOARDS | 13.1 For further technical specifications of our manufacturing processes, | MULTILAYER CIRCUITS MANUFACTURING | please refer to our Process & Capability Manual in the "Standard" category. These standard technical criteria also apply even if your manufacturing data and documents | MULTILAYER CIRCUITS MANUFACTURING | call for other features (special technical requirements are available in our Premium Jet Line). | 14. UL CERTIFICATION | 14.1 If the PCB is to | MULTILAYER CIRCUITS MANUFACTURING | be produced in line with our UL Certification, please follow the ...
[ Multilayer Circuits Manufacturing ]


... | Forming Microvias in Laser- ITechnology - In Rapid Proto-Typing | In Medium to High Volume | In Rapid Mass-Production (high- Ispeed/high volume) - | MULTILAYER CIRCUITS MANUFACTURING | Specifications in DIN | in MIL | in IPC | In UL-Approval listed under File No.:96892 - In SMOBC Circuitry | Bare copper with LPI | MULTILAYER CIRCUITS MANUFACTURING | Solder Mask | OSP - Organic Surface IProtection - In HAL - Hot Air Leveling also RoHS- Compliant (Lead-free) - Gold Fingers-, Tabs-, or Body | MULTILAYER CIRCUITS MANUFACTURING | Plating | Nickel & Immersion Gold (NiPAu) | Immersion ITin Protection | Immersion Silver = Imm Ag | OSP (Organic Surface Protection) - Legend & | MULTILAYER CIRCUITS MANUFACTURING | Special Screen Printing | Carbon Ink | Peelable Ink - Profile in Routing | V-Scoring | Punching | Cutting | and Milling - With Electrical | MULTILAYER CIRCUITS MANUFACTURING | Testing | ESPECIALLY DURING THE LAST FEW YEARS | we succeeded in realizing new sophisticated concepts of automatisation, flexibility and other improvements in production techniques. | MULTILAYER CIRCUITS MANUFACTURING | Therefore we are able to offer state-of-the-art quality for a rate beating world market prices. As in times ...
[ Multilayer Circuits Manufacturing ]


... metal deposition on an unclad substrate with electroplating or with etching, or with both | SMOBC SOLDER MASK OVER BARE COPPER. | A method | MULTILAYER CIRCUITS MANUFACTURING | of fabricating a printed wiring board which results in the final metallization being copper with no other protective metal but the non soldered areas are | MULTILAYER CIRCUITS MANUFACTURING | coated by a solder resist, exposing only the component terminal areas. | SOLDER LEVELING |The process of dipping PCB's into hot liquids, or exposing them | MULTILAYER CIRCUITS MANUFACTURING | to liquid waves to achieve fusion. First, flux is applied to the board by dipping or brushing. Then the board is preheated in a liquid | MULTILAYER CIRCUITS MANUFACTURING | (maintained at 250 F). Next, the board is immersed in fusing liquid at 430 - 500 F. Finally, it is dipped in another 250 F | MULTILAYER CIRCUITS MANUFACTURING | liquid to cool it and reduce thermal shock. Thin fused coatings can be applied. | SOLDER RESISTS (SOLDERMASK) | Coatings which mask off and surface | MULTILAYER CIRCUITS MANUFACTURING | insulate those areas of a circuit where soldering is not desired. | STEP AND REPEAT | A method by which successive exposures of a single ...
[ Multilayer Circuits Manufacturing ]