... a surround of at least 300µ around the hole. 7 Pad 7.1 If non-plated holes are positioned on one pad, the pad must have | MULTILAYER CIRCUITS FAB | a surround of at least 500µ larger than the hole. Otherwise some/all of the pads may be removed. 8 Solder Resists 8.1 Please refrain from | MULTILAYER CIRCUITS FAB | oversizing when drafting solder resists, i.e. the solder stop spaces are 1:1 to the pads. This facilitates the incorporation and required stretching of the solder | MULTILAYER CIRCUITS FAB | resists during the manufacturing process. 9 Silkscreen 9.1 In order to perfectly reproduce silkscreens, the type must be at least 1mm high and the stroke | MULTILAYER CIRCUITS FAB | at least 200µ thick. Also, all surrounding solder areas must be clear of component print for at least 250µ or imperfect print and printed solder | MULTILAYER CIRCUITS FAB | areas may result. 10 Non-plated Holes 10.1 This refers to plated through PCBs: If we do not have any information from you as to which | MULTILAYER CIRCUITS FAB | holes are to be plated-through and which are not, we will determine this to the best of our knowledge. 11 Data Provided (Data Inconsistency) ...
[ Multilayer Circuits Fab ]


... up to 1000 dm² PCBs size and pass the cost savings of the combined production on to you. Data preparation and technical support is, | MULTILAYER CIRCUITS FAB | of course, included. | SELECTED CAPABILITIES: | Archiving Process Data Drill- / Milling Program Archiving Customer Data Production Data Conversion E-Test optional Design Check UL | MULTILAYER CIRCUITS FAB | - Listing optional Design Adjustment Further Options | TECHNICAL SPECIFICATION: | Delivery: in Single Board Format as well as in Panelized Board Arrays and Sub-Arrays | MULTILAYER CIRCUITS FAB | with / without Fixing Tabs finished by Milling and Scoring to size. M| ILLING-COORDINATES [-?-]: | One with Milled Outline. One MAA-Unit (MAA-U) is made | MULTILAYER CIRCUITS FAB | up of 20 MAA´s Data-Base Format: Gerber, ODB++, DPF Type of the Base Material: FR 4 Amount of Layers: 1, 2, 4, 6 Surface Protection: | MULTILAYER CIRCUITS FAB | HAL Layer Build-Up: | ELECTRICAL TESTING: | Flying Probe or Adaptor Final Thickness of PCB: 1,55 mm to 2,40 mm Junction in Line-Production: Yes Min. | MULTILAYER CIRCUITS FAB | Track Width + Spacing: 150µ / 150µ Smallest pad: 0,80 mm Min PCB-Length / With: ...
[ Multilayer Circuits Fab ]


... of the circuit structure image concealed beneath the copper foil. This data enables either the best possible positioning of pinning holes for further processing | MULTILAYER CIRCUITS FAB | on other CNC machines, or the layers of each individual multi layer can be aligned and operated with the local CNC routine. Bordering takes place | MULTILAYER CIRCUITS FAB | at the same time to remove the copper and epoxide projections from the edges of the Panel and to achieve its specified dimensions Of course | MULTILAYER CIRCUITS FAB | the layer recognition routine takes longer than a conventional CNC procedure, but it is not presumptuous to claim that immediately after pressing the multi layer | MULTILAYER CIRCUITS FAB | has the quality of a plated throug circuit The art of viewing chicken eggs clearly. Although the fundamental idea appears ingeniously simple, the most sophisticated | MULTILAYER CIRCUITS FAB | German technology was necessary to carry it out. It was extremely complicated to develop a camera system which can not only see all spatial levels | MULTILAYER CIRCUITS FAB | equally clearly, but is also able to see the lines located at different ...
[ Multilayer Circuits Fab ]