... specifications – technical and commercial! If you are unable to use an output file in the described data formats please contact our artwork department | MULTILAYER CIRCUITS | or sales engineer. 3.2 Data transmission The most comfortable way to send your data is by Email. It is advisable to compress them as a | MULTILAYER CIRCUITS | „zip file“ (pkzip, arj, lharc or winzip are also accepted). It prevents information from getting lost. Make sure that your data are easily recognisable, i.e. | MULTILAYER CIRCUITS | put all data of one type in one zip file. To prevent the inclusion of viruses, do not use ‘self-extracting’ compression software. Before sending your | MULTILAYER CIRCUITS | E-mail, please indicate the name of the zip file in the message section. Do not forget to send your commercial order (indicating the zip file | MULTILAYER CIRCUITS | name) by E-mail or fax. 3.3 Design rule check All CAD data supplied to us are checked using a standard design rule check and customized | MULTILAYER CIRCUITS | DFM- functions, which has been drawn up in accordance with the required IPC guidelines, our capability matrix and ...
[ Multilayer Circuits ]


... in the foreground. Today all possible products, materials, constructions and systems are tested and evaluated regarding their electrical danger as well as their danger | MULTILAYER CIRCUITS | of accident and fire. And in addition there were examined alarm systems and the ability to discover, control and prevent fire. | UL DEVELOPS SAFETY | MULTILAYER CIRCUITS | | regulations, which are taken over frequently as ANSI standards. Underwriters Laboratories certify and register customers according to ISO 9000. More... | PRINTED CIRCUIT BOARDS | MULTILAYER CIRCUITS | | | RAPID MASS PRODUCTION (RMP |) is a new and unique express service for large and medium-sized series ( 3 to 30 qm production | MULTILAYER CIRCUITS | size). The manufacture of multi-layers takes only 9 working days and double-sided pressings only 7 ! ( Minimum charge: 10% of order value). So far, | MULTILAYER CIRCUITS | express services have been mostly in the realm of prototype manufacturers, but RMP is on offer to all customers who recognise the market opportunities resulting | MULTILAYER CIRCUITS | from accelerated product launches or speedier completion ...
[ Multilayer Circuits ]


... > TERMINOLOGY AND TERMS OF PRINTED CIRCUIT BOARDS | | LAND | A portion of a conductive pattern usually, but not exclusively, used for | MULTILAYER CIRCUITS | the connection and / or attachment of components. Also called Pad, Boss, Terminal Point, Tab, Spot or Donut. | LANDLESS HOLE | A plated-through hole | MULTILAYER CIRCUITS | without a land(s). | LASER VIAS | Are partial vias which are produced by a laser. They may connect two adjacent layers. Through-vias cannot be | MULTILAYER CIRCUITS | produced with this technique. | LAYER-TO-LAYER SPACING | The thickness of dielectric material between adjacent layers of conductive circuitry. | LAY-UP | The technique of | MULTILAYER CIRCUITS | registering and stacking layers of a multilayer board before the laminating cycle. | LIQUID FILM PHOTO-SENSITIVE | laquer applied to the board by screen printing, | MULTILAYER CIRCUITS | curtain coating, or spraying. Afterwards, the laquer is cured sufficiently for the solder mask pattern to be photo-transferred to it before the unexposed parts are | MULTILAYER CIRCUITS | removed through a developing ...
[ Multilayer Circuits ]