... as well as reflow. The tin-copper system promises advantages in terms of the copper’s peeling reactions (leaching) on the circuit boards. The effect on | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | the copper surface is halved. SnAgCu - Systems Sn-0.7Cu-0.1Ni (SnCuNi) Melting point (eutectical point) 217 227 Procedure characteristic reflow/convect Tpeak = 230 C° Tpeak 240 | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | C° Procedure characteristics Wave Bath temp.: 255 – 265 C Bath temp.: 255 - 260 Ecolog. disadvantages Silver content 00 Metal Price 12 – 13 | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | € 7 – 8 € Leaching (CU peeling) Agressiv, high Leaching - Rate Leaching Rate 0,5 of SnAgCu Soldering error rate compared with SnPB Equal | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | solder bridging, more non- soldering Equal solder bridging, more non-soldering Costs must be kept in mind. The silver system is approximately 40% more expensive than | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | SnCuNi due to the use of precious metal; also, there is the ecological disavantage. Lead Sensitivity The problem of lead sensitivity during the lead-free conversion | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | phase in 2006 remains unsolved. Structural changes ...
[ Multilayer Circuit Boards Technologies ]


... is still the greatest quality risk in the production of multi-layers. Until now, in order to maintain an acceptable reject rate, many extremely machine-intensive | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | work steps have been necessary (e.g. the use of x-ray machines). Thanks to a revolutionary technique developed In cooperation with the Lenz Company and the | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | Frauenhofer Institute, for which a patent has been applied, we have managed to eliminate the quality pifalls as well as to combine all of the | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | work steps, from stock recognition to CNC drilling into one step. The advantages for cost and competiveness are immense ! The Problem Multi-layer pressing can | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | only guarantee the best innerlayer adhesion if the fibre glass mats soaked in epoxide resin (prepregs), positioned between the innerlayers as a dielektric medium, gel. | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | As a result of the high pressures (150 bar) and temperatures (175 C) applied the resin becomes so fluid that the inner-layers actually swim and expand | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | due to the heat. This can result in undefined ...
[ Multilayer Circuit Boards Technologies ]


... to all customers who recognise the market opportunities resulting from accelerated product launches or speedier completion of orders. The following brief feature describes the | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | manufacturing concept that we have developed to achieve just such a solution: | TEST US | Apart from technical specialisation, the market in multilayer business | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | is divided largely into two groups: those that manufacture in the largest possible series, and those that produce prototypes and mini series in the fastest | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | possible time in order to encourage the development of new products. Their strengths, however, are also their weaknesses. The fast producers must remain small in | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | order to be flexible, whereas the volume of orders received by the large producers awakens acquisitive interest from the even larger international manufacturers who, thanks | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | to wage differentials in the world, squeeze profit margins through price dumping until “withdrawal” from the market occurs. | "RAPID MASS PRODUCTION“ | is an | MULTILAYER CIRCUIT BOARDS TECHNOLOGIES | idea ...
[ Multilayer Circuit Boards Technologies ]