... test is needed to check the actual functions of a PCB. It is an essential if inner layers need to be tested, as is | MULTILAYER CIRCUIT BOARDS PROTOTYPE | the case with multi-layers. In two position measurements all connections in the PCB are checked for stoppages and short circuits . All SMD pads and | MULTILAYER CIRCUIT BOARDS PROTOTYPE | plated through holes are checked. The electrical test can be conducted as a parallel or finger test. PARALLEL TEST: For the parallel test a control | MULTILAYER CIRCUIT BOARDS PROTOTYPE | adaptor is constructed, consisting, e.g. of several synthetic sheets positioned above each other and fitted with control pins. An adaptor programme must be written to | MULTILAYER CIRCUIT BOARDS PROTOTYPE | reflect the actual holes in each individual synthetic layer of the adaptor. The pin positions are identical to the control points enabling an overall PCB | MULTILAYER CIRCUIT BOARDS PROTOTYPE | test within seconds. The control adaptors are all the more expensive the higher the density and the lower the grid distances between control points. The | MULTILAYER CIRCUIT BOARDS PROTOTYPE | adaptors can also only be used for one specific type of PCB which explains the high set-up costs for the ...
[ Multilayer Circuit Boards Prototype ]


... their limitations. Moreover, the dual-laser technique, like the other laser processes, requires only a single panel run to complete all steps of microvia formation. | MULTILAYER CIRCUIT BOARDS PROTOTYPE | The dual-laser technique illustrates the versatility of CO2 and UV DPSS lasers for high-volume microvia formation over a broad range of materials and operating conditions. | MULTILAYER CIRCUIT BOARDS PROTOTYPE | In fact, their adaptability has helped to establish these two laser types as industry workhorses in applications from prototyping to full production runs. For manufacturers, | MULTILAYER CIRCUIT BOARDS PROTOTYPE | the key to cost-effective, high-volume microvia formation lies in understanding the unique capabilities of these two lasers (Table). Comparison of Laser Capabilities Laser Type UV | MULTILAYER CIRCUIT BOARDS PROTOTYPE | DPSS RF CO2 Compatible Dielectric Types FR-4, RCF, Polyimide, PTFE, Aramid FR-4, RCF, Polyimide, PTFE, Aramid Microvia Diameter in Production 25 mm to 150 mm | MULTILAYER CIRCUIT BOARDS PROTOTYPE | 80 mm to 250 mm Typical Drilling Speed 30-mm diameter via at 100 holes per second (copper + dielectric) 100-mm diameter via at 450 holes | MULTILAYER CIRCUIT BOARDS PROTOTYPE | per second ...
[ Multilayer Circuit Boards Prototype ]


... are determined by the conscience to meet our customer`s needs. Quality concerns everybody in our company. Our executive staff must show an exemplary and | MULTILAYER CIRCUIT BOARDS PROTOTYPE | leading behaviour in every aspect of quality. Development and promotion of fault avoiding working spirit. A cooperative management style is the first condition for involving | MULTILAYER CIRCUIT BOARDS PROTOTYPE | our employees in the process of solving problems. | MISSION STATEMENT | (Aims and strategies in our policy of quality) "We are dedicated to total | MULTILAYER CIRCUIT BOARDS PROTOTYPE | customer satisfaction through continuous improvement in quality, technology and cycle times. (For us quality is the creation of a product that meets our customer`s requirements | MULTILAYER CIRCUIT BOARDS PROTOTYPE | at 100 percent. This means precisely not only to guarantee the physical and functional attributes of a product but also every aspect of service linked | MULTILAYER CIRCUIT BOARDS PROTOTYPE | to the ...
[ Multilayer Circuit Boards Prototype ]