... is inevitably, since the material has been exposed several times to thermal procedures like solder mask burn in, HAL etc. Standard µ Special µ | MULTILAYER CIRCUIT BOARDS PRODUCTION | Technical limit µ Offset PTH-drill to contouring* +/- 200 +/- 150 +/- 100 Offset layout to contouring +/- 200 +/- 150 +/- 100 5.11 V- | MULTILAYER CIRCUIT BOARDS PRODUCTION | cutting (scoring) Regarding V-cutting the same dimension tolerances are to be considered as for routing. Please pay attention to the fact that a certain circuit-free | MULTILAYER CIRCUIT BOARDS PRODUCTION | space depending on material thickness must be available around the outlines. E.g. using material of 1,5 mm thickness by considering a dimension tolerance of +/- | MULTILAYER CIRCUIT BOARDS PRODUCTION | 0,2 mm tracks/pads etc. must have a spacing around the outlines of 0,40 mm. If the dimension tolerance is required to be without plus values | MULTILAYER CIRCUIT BOARDS PRODUCTION | the applied minus tolerance has to be added to the respective circuit-free spacing. Material Thickness circuit-free spacing at the outlines up to 1,00 mm 0,35 | MULTILAYER CIRCUIT BOARDS PRODUCTION | mm 1,10 mm to 1,60 mm 0,40 mm 1,70 mm to 2,00 mm 0,55 mm 2,10 mm to 2,50 mm 0,65 mm ...
[ Multilayer Circuit Boards Production ]


... reduced the size of components but also allowed components to be attached to both sides of the PCB, further accentuated the need for MLBs | MULTILAYER CIRCUIT BOARDS PRODUCTION | of increasing complexity. Alternative via-hole technologies for MLBs are also presented at the end of this document. The Cycle Multilayer manufacture can be broken into | MULTILAYER CIRCUIT BOARDS PRODUCTION | three parts; inner layer fabrication, lamination and manufacture as it applies to double-sided boards. The first two steps, specific to multilayers are shown in the | MULTILAYER CIRCUIT BOARDS PRODUCTION | following flow chart: Just click on the start button and you can see awful fotos of how a state-of-the-art facility works. (Sorry - no frequent | MULTILAYER CIRCUIT BOARDS PRODUCTION | flyer miles apply)!' Customer Contact | OUR SALES ORGANISATION | is in regular contact with customers to keep up to date with their requirements and | MULTILAYER CIRCUIT BOARDS PRODUCTION | offer solutions to their problems. As a 'Total Solution' company capable of meeting all customers' interconnection requirements, We are able to make customers' lives easier, | MULTILAYER CIRCUIT BOARDS PRODUCTION | irrespective of the type of board required, through ...
[ Multilayer Circuit Boards Production ]


... place in a vacuum environment. The press applies heat and pressure so that the thermosetting resin in the prepreg undergoes cross-linking which bonds all | MULTILAYER CIRCUIT BOARDS PRODUCTION | layers together. The press then goes through a critical cooling cycle before the book is removed and pulled apart. The edges of the multilayer panels | MULTILAYER CIRCUIT BOARDS PRODUCTION | are then trimmed to eliminate any of the resin outflow and to smooth out uneven or rough edges. Special attention was given to environmental compatibility | MULTILAYER CIRCUIT BOARDS PRODUCTION | and safety conditions. Furthermore, the facility was designed to accommodate future expansions. The requirements were as follows: - LP formats: Up to 640 x 610 | MULTILAYER CIRCUIT BOARDS PRODUCTION | mm - LP thickness: 0.30 – 10.0 mm - Materials: FR- 4, BT-epoxy, polyimide, “Thermount”/RCF - Heat ramp rates: 5-6°C/min. (measured as a package) Great | MULTILAYER CIRCUIT BOARDS PRODUCTION | emphasis was put on automation for stacking and for enclosed separation sheet circulation. The flow directions for the transport sheets and separation sheets are intentionally | MULTILAYER CIRCUIT BOARDS PRODUCTION | interrupted after de-stacking, enabling ...
[ Multilayer Circuit Boards Production ]