... due to the lack of other alternatives in the lead-free future immersion nickel / gold will retain its position in the area of fine | MULTILAYER CIRCUIT BOARDS PRODUCE | pitch and COB applications. Cost disadvantages of the immersion nickel / gold process could be balanced, in particular in the production of large series (consumer | MULTILAYER CIRCUIT BOARDS PRODUCE | goods), if the use of chip-on-board is considered. It is often worth purchasing “bare” chips and connecting them directly to the PCB with bonding wire. | MULTILAYER CIRCUIT BOARDS PRODUCE | The amount saved on the chip casing could then pay off. | ERROR HIGHLIGHTS | > What are the most frequent mistakes or omissions? From | MULTILAYER CIRCUIT BOARDS PRODUCE | the view of a pcb-manufacturer? (in order of the frequency) 1.) The indication, which drillings or milling should be plated through or not plated through. | MULTILAYER CIRCUIT BOARDS PRODUCE | 2.) The dimensions on separately enclosed measure plans do not agree with the outline of the gerberdata. 3.) Data concerning the outer contour are missing. | MULTILAYER CIRCUIT BOARDS PRODUCE | 4.) The aperturetable or the explanation of the symbolism of the aperturetable is missing. 5.) By ...
[ Multilayer Circuit Boards Produce ]


... processes start. A rapid fall in temperature of more than 7 degrees causes condensation on the stored PCB`s. Humidity should never exceed 65 %. | MULTILAYER CIRCUIT BOARDS PRODUCE | The package must be kept intact although the polyethylene packages capability of keeping humidity away is not really reliable. A.3 2 ) Storage time | | MULTILAYER CIRCUIT BOARDS PRODUCE | THE STORAGE TIME OF PCB`S | should be as short as possible. PCB`s should be taken out due to the „first-in, first out“ rule. The | MULTILAYER CIRCUIT BOARDS PRODUCE | the polyethylene packages should be taken away just before the assembling. Remaining PCB`s should be repacked again. To avoid exposure to draught, the packages should | MULTILAYER CIRCUIT BOARDS PRODUCE | be stored in boxes. A.4 3 ) | SOLDERING TESTS PCB`S | stored for over several months and being transported under questionable conditions, should be | MULTILAYER CIRCUIT BOARDS PRODUCE | submitted again to a soldering test, being equivalent to your soldering process. A.5 4 ) | HEAT CONDITIONING OF THE PCB`S | In any case | MULTILAYER CIRCUIT BOARDS PRODUCE | we suggest a drying process of the PCB`s in a stove to reduce the moisture in the PCB`s to an acceptable minimum. ...
[ Multilayer Circuit Boards Produce ]


... if delamination tests are made after production, the danger of delamination can rise again due to unsafe transportation and long storage times. Therefore we | MULTILAYER CIRCUIT BOARDS PRODUCE | would like to give you following proposals to avoid the described problems: A.2 1 ) | STORAGE CONDITIONS PCB`S | should be stored in heated | MULTILAYER CIRCUIT BOARDS PRODUCE | and dry rooms. Constant low humidity is necessary before the soldering processes start. A rapid fall in temperature of more than 7 degrees causes condensation | MULTILAYER CIRCUIT BOARDS PRODUCE | on the stored PCB`s. Humidity should never exceed 65 %. The package must be kept intact although the polyethylene packages capability of keeping humidity away | MULTILAYER CIRCUIT BOARDS PRODUCE | is not really reliable. A.3 2 ) Storage time | THE STORAGE TIME OF PCB`S | should be as short as possible. PCB`s should be | MULTILAYER CIRCUIT BOARDS PRODUCE | taken out due to the „first-in, first out“ rule. The the polyethylene packages should be taken away just before the assembling. Remaining PCB`s should be | MULTILAYER CIRCUIT BOARDS PRODUCE | repacked again. To avoid exposure to draught, the packages should be stored in boxes. A.4 3 ) | ...
[ Multilayer Circuit Boards Produce ]