... with the layers, and explained to the fabricator in a README file. The idea here is that the fabricator should be able to quickly | MULTILAYER CIRCUIT BOARDS PLANT | understand what each file is and where it goes in the stackup. If you wish to continue using | GERBER DATA |, switch to 274X. | MULTILAYER CIRCUIT BOARDS PLANT | 274D is obsolete; the external aperture information is more cumbersome and difficult for fabricators to deal with because they have to worry about translators and | MULTILAYER CIRCUIT BOARDS PLANT | parsers to read the aperture table information. As a result, aperture data might be misinterpreted. Worse, someone might have typed in the information manually - | MULTILAYER CIRCUIT BOARDS PLANT | and erroneously. By contrast, in 274X, all the aperture information is contained within the Gerber file, which can be read by most CAM tools automatically. | MULTILAYER CIRCUIT BOARDS PLANT | For netlists, | IPC-D-356 | is the preferred format for fabrication. It's widely used by many of the bare-board test-fixturing machines and is one of | MULTILAYER CIRCUIT BOARDS PLANT | the only true ways to identify power- to-ground shorts. With the information in this format coming ...
[ Multilayer Circuit Boards Plant ]


... you quickly access the services we offer, the following is a guide to the preferred requirements for producing quality Printed Circuit Boards. Can be | MULTILAYER CIRCUIT BOARDS PLANT | supplied as artworks, penplots, photoplots or photoplot files, so long as the quality and registration of the images is of a standard that will enable | MULTILAYER CIRCUIT BOARDS PLANT | a good quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These marks could be | MULTILAYER CIRCUIT BOARDS PLANT | the board reference so long as it cannot be read from the other side. (This is for your protection to prevent the boards made inside | MULTILAYER CIRCUIT BOARDS PLANT | out). Images should comply with design rules that will result in a board that will meet performance and cost requirements. ARTWORKS Scale must be given, | MULTILAYER CIRCUIT BOARDS PLANT | tapes securely stuck to the backing sheet, track to pad & track to track joints complete and the backing sheet clean. PENPLOTS Scale must be | MULTILAYER CIRCUIT BOARDS PLANT | given and be at least 2:1. Plots must also offer sharp edge definition and traces dense enough for blocking light ...
[ Multilayer Circuit Boards Plant ]


... in both vertical and horizontal process equipment, the versatile system yields total process cost reduction Panel Plating a Flash of Copper The panels are | MULTILAYER CIRCUIT BOARDS PLANT | online in a wet state transferred to our automatic electrolytic copper plating lines to get a flasch of copper.. The panels are attached to plating | MULTILAYER CIRCUIT BOARDS PLANT | racks. When the racks are moved to the loading station, the system computer instructs the hoist to pick up the rack and begin the plating | MULTILAYER CIRCUIT BOARDS PLANT | cycle. The copper plating time is approximately one hour. Electrolytic copper of minimum thickness 12 microns is deposited on the surface of the panel and | MULTILAYER CIRCUIT BOARDS PLANT | on the walls of the drilled holes. This is achieved by applying an electric current to a cell comprising the panel (the cathode) and a | MULTILAYER CIRCUIT BOARDS PLANT | set of copper bars (the anodes) suspended in a conducting medium (the electrolyte). A plating history log is maintained on the shop floor control computer | MULTILAYER CIRCUIT BOARDS PLANT | which assists the operator in making minor adjustments to the plating current. Finally, the panels are ...
[ Multilayer Circuit Boards Plant ]