... third parties, especially to address traders or other companies is out of the question. | CAN THE GOVERNMENT DEMAND DATA DISCLOSURE? | If legal | MULTILAYER CIRCUIT BOARDS MANUFACTURING | regulations exist whereby data must be passed on to local, state, national or international governmental authorities, we comply (e.g. providing the Export Control Authorities with | MULTILAYER CIRCUIT BOARDS MANUFACTURING | the identity of a purchaser of specific PCB products according to our export permits). A dditionally, we can disclose information in order to check or | MULTILAYER CIRCUIT BOARDS MANUFACTURING | prevent illegal activities or suspicion of fraud, or to initiate respective counter measures. | WHAT IS YOUR POLICY ON SURVEYS? | We occasionally request details | MULTILAYER CIRCUIT BOARDS MANUFACTURING | from our customers when undertaking a survey. Participation in such surveys is voluntary and the customer is entirely free to decide whether he provides us | MULTILAYER CIRCUIT BOARDS MANUFACTURING | with the information or not. | THE SURVEY DATA | is used to supervise and improve the use of this web site, as well as | MULTILAYER CIRCUIT BOARDS MANUFACTURING | to improve our services and products. | CAN WE CANCEL YOUR OCCASIONAL MESSAGES AND ...
[ Multilayer Circuit Boards Manufacturing ]... BOARDS | Technical Terms of Delivery | 1. WORKING DAYS | 1.1 The day, on which the order and the complete production data are | MULTILAYER CIRCUIT BOARDS MANUFACTURING | made available not later than 6 p.m., does not count as a working day. If the order and/or the production data are made available after | MULTILAYER CIRCUIT BOARDS MANUFACTURING | 6 p.m., the first working day is t he day after next. 1.2 Technical preconditions: Productions data and orders which are faulty, incomplete, or vary | MULTILAYER CIRCUIT BOARDS MANUFACTURING | from the details on which the offer is based lead to delays in delivery and/or incorrect execution of the order, etc. | 2. LIABILITY DISCLAIMER | MULTILAYER CIRCUIT BOARDS MANUFACTURING | | 2.1 We do not accept responsibility for any errors incurred when referring to offers or when enquiring. | 3. CORRECT SIDE | PRINTED CIRCUIT | MULTILAYER CIRCUIT BOARDS MANUFACTURING | BOARDS | 3.1 In order to be able to recognise the correct side (mirrored or unmirrored image) legible type must be visible in an external | MULTILAYER CIRCUIT BOARDS MANUFACTURING | position on the conductive pattern. 3.2 The order of layer construction must be given for multilayers. We are not liable for correct execution if we | MULTILAYER CIRCUIT BOARDS MANUFACTURING | are not ...
[ Multilayer Circuit Boards Manufacturing ]... rate compared with SnPB Equal solder bridging, more non- soldering Equal solder bridging, more non-soldering Costs must be kept in mind. The silver system | MULTILAYER CIRCUIT BOARDS MANUFACTURING | is approximately 40% more expensive than SnCuNi due to the use of precious metal; also, there is the ecological disavantage. Lead Sensitivity The problem of | MULTILAYER CIRCUIT BOARDS MANUFACTURING | lead sensitivity during the lead-free conversion phase in 2006 remains unsolved. Structural changes in lead-free soldering caused by remains of lead (even below 0.1% weight) | MULTILAYER CIRCUIT BOARDS MANUFACTURING | in processing containers have been observed. Structural coarseness occurs in SnAgCu if there are stressful temperature changes even well below 96 C? (degradation acceleration). Lead | MULTILAYER CIRCUIT BOARDS MANUFACTURING | secretion occurs in bordeline grains in SnCuNi systems which, under mechanical tension, can create weak spots. Splitting is possible when soldering heat cools. Conclusion There | MULTILAYER CIRCUIT BOARDS MANUFACTURING | is no doubt that the “good old” lead/tin still provides the best soldering results. However, the two procedures presented above can be improved upon. ...
[ Multilayer Circuit Boards Manufacturing ]