... should be plotted on laser photoplotter or on vector photoplotter using a minimum resolution of ½mil (13mm). - Preferred in Gerber® format although accepted | MULTILAYER CIRCUIT BOARDS FAB | in other formats. (Refer to CID- 014 for information on Documentation in Digital Form). - files are the only acceptable form of supplying images for | MULTILAYER CIRCUIT BOARDS FAB | multilayers and boards with fine (0.2mm or smaller) tracks. Drawings Drawings must be supplied with each new job and should contain the following information to | MULTILAYER CIRCUIT BOARDS FAB | ensure that the finished board is to your requirements. - Always required even when a drill file is supplied, to enable inspection of panels immediately | MULTILAYER CIRCUIT BOARDS FAB | after drilling and finished boards prior to despatching. Hole sizes must be clearly represented with distinct differences between each size. Tolerances are not required unless | MULTILAYER CIRCUIT BOARDS FAB | different to our standard of +0.1 / -0.05 mm. - Preferred with overall mechanical dimensions including notches, cutouts and slots. Also preferred is a positioning | MULTILAYER CIRCUIT BOARDS FAB | (datum) dimension (drilled hole is ...
[ Multilayer Circuit Boards Fab ]


... | The electrodeposition of an adherent metal coating on a conductive object for protection, decoration, or other purposes. The object to be plated is | MULTILAYER CIRCUIT BOARDS FAB | placed in an electrolyte and connected to one terminal of a DC voltage source. The metal to be deposited is similarly immersed and connected to | MULTILAYER CIRCUIT BOARDS FAB | the other terminals. Ions of the metal provide transfer to metal as they make up the current flow between electrodes. | EPOXY SMEAR | Epoxy | MULTILAYER CIRCUIT BOARDS FAB | resin which has been deposited onto the edges of the conductive pattern during drilling. Also called Resin Smear. | ETCH FACTOR | The ratio of | MULTILAYER CIRCUIT BOARDS FAB | the depth of etch (conductor thickness) to the amount of lateral etch (undercut). | ETCHBACK | The controlled removal of all components of base material | MULTILAYER CIRCUIT BOARDS FAB | by a chemical process on the sidewalls of plated through holes in order to expose | ETCHING | The process of removing unwanted metallic substance | MULTILAYER CIRCUIT BOARDS FAB | (bonded to base) via chemical or chemical and electrolytic means. | ETCHING RESISTS | Materials deposited ...
[ Multilayer Circuit Boards Fab ]


... also accepted). It prevents information from getting lost. Make sure that your data are easily recognisable, i.e. put all data of one type in | MULTILAYER CIRCUIT BOARDS FAB | one zip file. To prevent the inclusion of viruses, do not use ‘self-extracting’ compression software. Before sending your E-mail, please indicate the name of the | MULTILAYER CIRCUIT BOARDS FAB | zip file in the message section. Do not forget to send your commercial order (indicating the zip file name) by E-mail or fax. 3.3 Design | MULTILAYER CIRCUIT BOARDS FAB | rule check All CAD data supplied to us are checked using a standard design rule check and customized DFM- functions, which has been drawn up | MULTILAYER CIRCUIT BOARDS FAB | in accordance with the required IPC guidelines, our capability matrix and customer´s engineers. If you have any questions regarding this issue, please contact the head | MULTILAYER CIRCUIT BOARDS FAB | of our pre-production office, Mr. Vornholt. Should the CAD data prove not to be suitable for production, the person responsible for the data will be | MULTILAYER CIRCUIT BOARDS FAB | contacted by the pre- production engineer dealing with the order. 3.4 Order confirmation After ...
[ Multilayer Circuit Boards Fab ]