... Printed Circuit Board and Multilayer Boards Technology ! Krefeld- The drilling correction of the inner-layer alignment is still the greatest quality risk in the | MULTILAYER BOARDS TECHNOLOGIES | production of multi-layers. Until now, in order to maintain an acceptable reject rate, many extremely machine-intensive work steps have been necessary (e.g. the use of | MULTILAYER BOARDS TECHNOLOGIES | x-ray machines). Thanks to a revolutionary technique developed In cooperation with the Lenz Company and the Frauenhofer Institute, for which a patent has been applied, | MULTILAYER BOARDS TECHNOLOGIES | we have managed to eliminate the quality pifalls as well as to combine all of the work steps, from stock recognition to CNC drilling into | MULTILAYER BOARDS TECHNOLOGIES | one step. The advantages for cost and competiveness are immense ! The Problem Multi-layer pressing can only guarantee the best innerlayer adhesion if the fibre | MULTILAYER BOARDS TECHNOLOGIES | glass mats soaked in epoxide resin (prepregs), positioned between the innerlayers as a dielektric medium, gel. As a result of the high pressures (150 bar) | MULTILAYER BOARDS TECHNOLOGIES | and temperatures (175 C) applied the resin ...
[ Multilayer Boards Technologies ]


... Der Kupferpreis stieg von... | MAKROÖKONOMISCH VOLLKOMMEN IDIOTISCH | Auszug aus "Markt&Technik" Nr. 23 vom 03.06.2005 zum Thema "Standort Deutschland II" | TROTZ SCHLECHTER | MULTILAYER BOARDS TECHNOLOGIES | RAHMENBEDINGUNGEN | - dass sich Leiterplatten auch am Standort Deutschland wett- bewerbsfähig produzieren lassen, davon ist Andreas Brüggen, Geschäftsführer von Precoplat, überzeugt. | DIE FRAGE, | MULTILAYER BOARDS TECHNOLOGIES | OB MAN IN DEUTSCHLAND NOCH WETTBEWERBSFÄHIG PRODUZIEREN KANN |, ist eindeutig mit »ja« zu beantworten. Die Grundvoraussetzungen sind zwar meiner Meinung nach schlechter als je | MULTILAYER BOARDS TECHNOLOGIES | zuvor, doch die schlechten Bedingungen begreifen wir als einen Appell an die Kreativität und Schaffenskraft der Unternehmer. | DAS PROBLEM IST |, dass dieser Appell | MULTILAYER BOARDS TECHNOLOGIES | ungehört verhallt, weil es immer weniger verantwortungsvolle Unternehmer gibt; die Zukunft vieler Mittelständler liegt vielmehr in den Händen von angestellten Managern, die Produktionen und ganze | MULTILAYER BOARDS TECHNOLOGIES | Fertigungen verlagern, um die Bilanzen ihrer innovationslahmen Unternehmen durch den ...
[ Multilayer Boards Technologies ]


... Always required even when a drill file is supplied, to enable inspection of panels immediately after drilling and finished boards prior to despatching. Hole | MULTILAYER BOARDS TECHNOLOGIES | sizes must be clearly represented with distinct differences between each size. Tolerances are not required unless different to our standard of +0.1 / -0.05 mm. | MULTILAYER BOARDS TECHNOLOGIES | - Preferred with | OVERALL MECHANICAL DIMENSIONS | including notches, cutouts and slots. Also preferred is a positioning (datum) dimension (drilled hole is best). Tolerances | MULTILAYER BOARDS TECHNOLOGIES | are not required unless different to our standard of + / -0.25 mm. | OTHER INFORMATION REQUIRED FOR ALL BOARDS INCLUDES: | board thickness (standard | MULTILAYER BOARDS TECHNOLOGIES | = 1.6mm) base copper thickness (std = 18mm) solder mask colour (std = green) solder mask type (std = liquid photoimageable) component legend colour (std | MULTILAYER BOARDS TECHNOLOGIES | = white) bare board testing requirement (std for multilayer and fine line production runs) Extra information required for multilayers | PRINTED CIRCUIT BOARDS | includes: | MULTILAYER BOARDS TECHNOLOGIES | special dielectric spacing ...
[ Multilayer Boards Technologies ]