... conductive material receptive to electroless deposition. Non-preferred synonyms: Seeding, Catalyzing, and Sensitizing. | ADDITIVE PROCESS | A process for obtaining conductive patterns by the | MULTILAYER BOARDS SERVICES | selective deposition of conductive material on unclad base material. See also, Semi-Additive Process and Fully-Additive Process. | ADHESION PROMOTION | The chemical process of preparing | MULTILAYER BOARDS SERVICES | a plastic surface to provide for a uniform, well-bonded metallic overplate. | ADHESIVE | A wide range of materials including animal and vegetable type glues, | MULTILAYER BOARDS SERVICES | rubbers, elastomers, thermosetting and thermoplastic resins, ceramics, and hot melts. Adhesives are used extensively for bonding, sealing and joining laminates, films and foils, coils, conductors, | MULTILAYER BOARDS SERVICES | etc. | ALIGN | The process of making two elements or processes meet properly. | ANALOG CIRCUIT | A circuit comprised mostly of discrete components | MULTILAYER BOARDS SERVICES | (i.e., resistors, capacitors, transistors) which produces data represented by physical variables such as voltage, ...
[ Multilayer Boards Services ]


... with each new job and should contain the following information to ensure that the finished board is to your requirements. - Always required even | MULTILAYER BOARDS SERVICES | when a drill file is supplied, to enable inspection of panels immediately after drilling and finished boards prior to despatching. Hole sizes must be clearly | MULTILAYER BOARDS SERVICES | represented with distinct differences between each size. Tolerances are not required unless different to our standard of +0.1 / -0.05 mm. - Preferred with overall | MULTILAYER BOARDS SERVICES | mechanical dimensions including notches, cutouts and slots. Also preferred is a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless different to | MULTILAYER BOARDS SERVICES | our standard of + / -0.25 mm. Other information required for all boards includes: board thickness (standard = 1.6mm) base copper thickness (std = 18mm) | MULTILAYER BOARDS SERVICES | solder mask colour (std = green) solder mask type (std = liquid photoimageable) component legend colour (std = white) bare board testing requirement (std for | MULTILAYER BOARDS SERVICES | multilayer and fine line production ...
[ Multilayer Boards Services ]


... as efficient as possible. To that end, here are suggestions and checklists that can assist fabricators in the review of their own front-end systems. | MULTILAYER BOARDS SERVICES | DATA FORMAT: 274D VS. 274X Bottleneck: 274D Gerber is one of the oldest tools available, and many designers use this format as their sole output | MULTILAYER BOARDS SERVICES | option. With 274D data, the front-end operator is left to deal with many issues, some even prior to data import: * Locate the aperture wheel | MULTILAYER BOARDS SERVICES | within the files. * Is the wheel for one file only or for all files? * What is the format of the wheel (inch, mm, | MULTILAYER BOARDS SERVICES | hard or soft dimensions, trailing zeros omitted, etc.)? * What is the format of the Gerber files? * Are all Gerber files in the same | MULTILAYER BOARDS SERVICES | format? * Was the aperture wheel received in electronic data format or paper copy? * If paper copy, then all apertures must be manually typed | MULTILAYER BOARDS SERVICES | in. Assume the operator must manually specify (type) any size, shape, height, width, length, break widths, inner diameters, outer diameters, and positive and negative ...
[ Multilayer Boards Services ]