... smaller more efficient boards have led to higher layer count multilayers, smaller holes and finer lines. These techniques, however, have not always been able | MULTILAYER BOARDS PROTOTYPE | to satisfy designer's often desperate needs to overcome real estate constraints whilst trying to maximise component configurations. As a result new alternatives such as buried | MULTILAYER BOARDS PROTOTYPE | vias, blind vias or a mixture of both have been successfully utilised by designers trying to maximise board real estate by increasing the density of | MULTILAYER BOARDS PROTOTYPE | lines and pads. However, many manufacturing and design issues must be addressed before adventuring down this path. Due to the many additional oper- ations, the | MULTILAYER BOARDS PROTOTYPE | cost of a blind or buried via board is significantly higher than that of a multilayer of the same layer count. | BURIED VIAS | | MULTILAYER BOARDS PROTOTYPE | A buried via is a copper-plated hole, imbedded in the board, that interconnects two internal layers. The buried via process starts by drilling holes on | MULTILAYER BOARDS PROTOTYPE | thin core laminate. These cores are then metallised, imaged and etched ...
[ Multilayer Boards Prototype ]


... loss, which have to avoid or to limit. | IN ORDER TO ACHIEVE THIS GOAL |, not only the control of the own production | MULTILAYER BOARDS PROTOTYPE | processes is necessary, also as a starting point of the manufacturing is the procurement of qualitatively perfect products of our suppliers. Therefore obligate our suppliers | MULTILAYER BOARDS PROTOTYPE | to be able to manufacture in application of our consistent quality philosophy and in definition of methodology and realization provably the correct quality. For this | MULTILAYER BOARDS PROTOTYPE | among other things counts the obligation of our suppliers to attach to each supply a test certificate. This demand is a component of our quality | MULTILAYER BOARDS PROTOTYPE | management system and we evaluate and control it continuously with an evaluation procedure. Beyond that the examinations are regulated in our house by employment regulations | MULTILAYER BOARDS PROTOTYPE | in the inspection of incoming goods. - In the case of | EACH INCOMING ORDER | we examine first the contract and the reproductibility. Hereby | MULTILAYER BOARDS PROTOTYPE | the complete manufacturing process is simulated, so that the ...
[ Multilayer Boards Prototype ]


... The SnCuNi system is particularly interesting for the PCB manufacturer as the investment needed to convert from conventional lead-tin techniques to tin/copper is far | MULTILAYER BOARDS PROTOTYPE | lower than for facilities providing the processing technology for chemically produced surfaces. Because, this is also a melting pot procedure. And only the solder’s tolerance | MULTILAYER BOARDS PROTOTYPE | with the dipping-container needs to be further researched. Our company is already working on solutions with mechanical engineering manufacturers. From May 2004, we plan to | MULTILAYER BOARDS PROTOTYPE | offer our customers SnCuNi is series production. Soldering Trials As already mentioned, there has been insufficient field research. Therefore direct comparison of soldering characteristics has | MULTILAYER BOARDS PROTOTYPE | been undertaken in diverse trial campaigns by expert and work groups (BDF Germany, Boeing USA). Both systems enable smooth, shining surfaces and reliable soldering joins, | MULTILAYER BOARDS PROTOTYPE | using wave soldering as well as reflow. The tin-copper system promises advantages in terms of the copper’s peeling ...
[ Multilayer Boards Prototype ]