Multilayer Boards Production The milling groove itself is 2.4 mm for the contours of a PCB or Printed Circuit Boards

... to eliminate any of the resin outflow and to smooth out uneven or rough edges. Special attention was given to environmental compatibility and safety | MULTILAYER BOARDS PRODUCTION | conditions. Furthermore, the facility was designed to accommodate future expansions. The requirements were as follows: - LP formats: Up to 640 x 610 mm - | MULTILAYER BOARDS PRODUCTION | LP thickness: 0.30 – 10.0 mm - Materials: FR- 4, BT-epoxy, polyimide, “Thermount”/RCF - Heat ramp rates: 5-6°C/min. (measured as a package) Great emphasis was | MULTILAYER BOARDS PRODUCTION | put on automation for stacking and for enclosed separation sheet circulation. The flow directions for the transport sheets and separation sheets are intentionally interrupted after | MULTILAYER BOARDS PRODUCTION | de-stacking, enabling cleaning of sheets or buffering of empty stacks. With the aid of vacuum, a lot less pressure is required, resulting in less distortions | MULTILAYER BOARDS PRODUCTION | and virtually no air entrapment. Another plus is that very little resin flows from the multilayer. The finished result is a board with lower dielectric | MULTILAYER BOARDS PRODUCTION | constant, preferred for impedance ...
[ Multilayer Boards Production ]


... 200 Silk screen to PTH spacing 300 250 200 Line width 200 175 140 Minimum size of letters 1250 1000 800 Carbon key pad | MULTILAYER BOARDS PRODUCTION | printing Standard (µ) Special (µ) Technical limit (µ) Track to track spacing 500 400 400 Minimum track width 500 400 300 Peelable mask Standard Special | MULTILAYER BOARDS PRODUCTION | Technical limit Max diameter of covered holes 1,8 mm 2,0 mm 2,6*mm Thickness of peelable mask 300µ 400µ 500µ *coverage cannot be guaranteed 5.9 Contour | MULTILAYER BOARDS PRODUCTION | machining Contouring is performed by three possible techniques: * Routing * V-cutting These techniques allow contouring within the standard „DIN 7168 mittel“ (medium accuracy) and | MULTILAYER BOARDS PRODUCTION | „fein“ (precise accuracy). Dependant on the size of the board following tolerances are given: Board size: fine middle 0,5 mm up to 6 mm +/- | MULTILAYER BOARDS PRODUCTION | 0,05 mm +/- 0,10 mm 6 mm up to 30 mm +/- 0,10 mm +/- 0,20 mm 30 mm up to 120 mm +/- 0,15 | MULTILAYER BOARDS PRODUCTION | mm +/ 0,30 mm 120 mm up to 400 mm +/- 0,20 mm +/- 0,50 mm 400 mm up to 1000 mm +/- 0,30 mm | MULTILAYER BOARDS PRODUCTION | +/- 0,80 mm 1000 mm up to 2000 mm +/- 0,50 mm +/- 1,20 mm 5.10 Routing ...
[ Multilayer Boards Production ]


... or between the laminate and the conductive foil, or both. | DEPOSITION | The process of applying a material to a base by means | MULTILAYER BOARDS PRODUCTION | of vacuum, electrical, chemical, screening, or vapor methods. | DEWETTING | A condition which results when molten solder has coated a surface and then receded, | MULTILAYER BOARDS PRODUCTION | leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film base metal is not exposed. | DIELECTRIC | Any insulating | MULTILAYER BOARDS PRODUCTION | medium which intervenes between two conductors. | DIELECTRIC | Breakdown A complete failure of a dielectric material characterized by a disruptive electrical discharge through the | MULTILAYER BOARDS PRODUCTION | material due to a sudden and large increase in voltage. | DIELECTRIC STRENGTH | The maximum voltage that an insulating material can withstand before breakdown | MULTILAYER BOARDS PRODUCTION | occurs. | DIGITAL CIRCUIT | A circuit comprised of mostly integrated circuits which operates like a switch(i.e., it is either "ON" or "OFF"). | DIGITIZING | MULTILAYER BOARDS PRODUCTION | | The process of reducing feature locations on a flat ...
[ Multilayer Boards Production ]