... our long experience and continuous urge to high perfection we are situated in a market position, allowing us to compete with the best in | MULTILAYER BOARDS PRODUCER | quality, efficiency and delivery on time. Approximately 500 companies of the electronic industry, automotive, telecommunication, medical devices, aviation appliances and computer networking benefit from the | MULTILAYER BOARDS PRODUCER | quality of our products and services. On the company`s plant of 25.000 sqm we are able to produce 3.000 sqm of single-sided, 8000 sqm double- | MULTILAYER BOARDS PRODUCER | sided PCBs and 10.000 sqm Multilayer per month. Product Informations -- Interconnect Carriers -- | Boards | Circuits | PCBs | PWBs | PCB Carriers | | MULTILAYER BOARDS PRODUCER | Circuit Boards | Printed Wiring Boards | Printed Circuit Boards | Rigid Boards | Circuit Cards | Printed Circuits | | Single Sided | Double | MULTILAYER BOARDS PRODUCER | Sided | Plated Through Hole | Multilayer Boards up to 12 Layers | | HDI (high density) Boards | | Buried Vias | Blind Vias | MULTILAYER BOARDS PRODUCER | | Embedded components | In Fine-Line | in Micro-Fine-Line | in HDI-Technologie | Microvias in ...
[ Multilayer Boards Producer ]


... BOARDS | | INFRARED (IR) | Part of the electromagnetic spectrum between the visible light range and the radar range. | INFRARED FUSING | | MULTILAYER BOARDS PRODUCER | The melting of tin / lead plating on PCB's using the energy given off by infrared waves | INSULATION RESISTANCE | The electrical resistance of | MULTILAYER BOARDS PRODUCER | the insulating material between any pair of contacts, conductors, or grounding devices in various combinations. | INSULATION METAL SUBSTRATES (IMS) |  Insulated metal substrates (IMS), | MULTILAYER BOARDS PRODUCER | thermal substrates, SMI or Alep Twin - there are many names for special PCB´s that were developed for one main purpose: to draw the undesired | MULTILAYER BOARDS PRODUCER | heat from electric components off the circuit board at a reasonable cost and, if possible, saving space. | INTERFACIAL CONNECTION | A conductor which connects | MULTILAYER BOARDS PRODUCER | conductive patterns on opposite sided of a PCB or other base. | INTERNAL LAYER (INNERLAYER) | A conductive pattern contained entirely within a multilayer PCB | MULTILAYER BOARDS PRODUCER | | IMIDAZOL |Chemical compound of the formula C5 N2 HR3., application ...
[ Multilayer Boards Producer ]


... printed on or near any edge of a PCB and intended for mating with an edge connector. | ELECTROLESS DEPOSITION | The deposition of | MULTILAYER BOARDS PRODUCER | conductive material from an autocatalytic plating solution without application of electrical current. | ELECTROPLATING | The electrodeposition of an adherent metal coating on a conductive | MULTILAYER BOARDS PRODUCER | object for protection, decoration, or other purposes. The object to be plated is placed in an electrolyte and connected to one terminal of a DC | MULTILAYER BOARDS PRODUCER | voltage source. The metal to be deposited is similarly immersed and connected to the other terminals. Ions of the metal provide transfer to metal as | MULTILAYER BOARDS PRODUCER | they make up the current flow between electrodes. | EPOXY SMEAR | Epoxy resin which has been deposited onto the edges of the conductive pattern | MULTILAYER BOARDS PRODUCER | during drilling. Also called Resin Smear. | ETCH FACTOR | The ratio of the depth of etch (conductor thickness) to the amount of lateral etch | MULTILAYER BOARDS PRODUCER | (undercut). | ETCHBACK | The controlled removal of all components of base material by a chemical ...
[ Multilayer Boards Producer ]