Multilayer Boards Plant A void in the metallic deposit of a plated-through hole Printed Circuit Boards (PCBs)

... testing and certification organization. In the beginnings of UL more than 100 years ago stood questions in the range of fire-protection-mechanisms in the foreground. | MULTILAYER BOARDS PLANT | Today all possible products, materials, constructions and systems are tested and evaluated regarding their electrical danger as well as their danger of accident and fire. | MULTILAYER BOARDS PLANT | And in addition there were examined alarm systems and the ability to discover, control and prevent fire. UL develops safety regulations, which are taken over | MULTILAYER BOARDS PLANT | frequently as ANSI standards. Underwriters Laboratories certify and register customers according to ISO 9000. What means this indication for the Microcirtec GmbH and their customers? | MULTILAYER BOARDS PLANT | Products with this indication have international a higher acceptance. Many customers wish or demand a UL marking. The marking offers easements in questions of the | MULTILAYER BOARDS PLANT | product liability and brings a higher acknowledgment at authorities. In order to guarantee the adherence to the examined values, a Follow UP ...
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... Möglich- keiten sind einzigartig und noch immer gibt es hier industrielle Cluster, die gute Beschaffungs- und auch gute Absatzmärkte darstellen. Solange es diese Märkte | MULTILAYER BOARDS PLANT | gibt, lohnt es sich, weiter an der Schaffung eines Mehrwertes seiner Produkte zu arbeiten, als einfallslos nur Kosten über das Personal zu sparen. | DANK | MULTILAYER BOARDS PLANT | EINES BÜNDELS VON INNOVATIVEN LOGISTIK |- und Sonderleistungen konnten und können wir als mittelständisches Familienunternehmen mit 80 Mitarbeitern auch weiterhin im harten und von asiatischen | MULTILAYER BOARDS PLANT | Billigproduzenten heiß umworbenen Markt konventioneller Leiterplatten erfolgreich bestehen: | IN EINEM ERSTEN SCHRITT | entwickelten wir unser so genanntes Rapid-Mass- Production Konzept (RMP), das darauf | MULTILAYER BOARDS PLANT | ausgerichtet ist, mit Hilfe einer ausgeklügelten Fertigungslogistik auch Großserien im Expressdienst herzustellen. So erschloss sich uns plötzlich ein Kundenkreis, der schon auf dem Weg nach | MULTILAYER BOARDS PLANT | Asien war, aber dennoch eine schlagkräftige Kapazitätsreserve für ...
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... of the Future ! Since July 1st, lead soldering is no longer permitted, and the use of alternative surface refinements for pcb´s has so | MULTILAYER BOARDS PLANT | far provided unsatisfactory results, meaning that the lead-free problem has yet to be resolved. The chemical nickel-gold procedure (Imm NiAu) was unsuccessful due to high | MULTILAYER BOARDS PLANT | costs, as was chemical tin. Both procedures have proven to be very complicated and sensitive in the further course of processing management. Lead-free solderings also | MULTILAYER BOARDS PLANT | have serious disadvantages, as hot air tin surfacing exposes the multi-layers to higher processing temperatures and copper leaching effects. We would briefly like to explain | MULTILAYER BOARDS PLANT | why we believe chemical silver is the lead-free procedure of the future, and why it will be the focus of our future investments in the | MULTILAYER BOARDS PLANT | field of surface refinement: UNPROBLEMATIC WASTE WATER PROCESSING Similarly to chemical tin surfacing, it is a non-electrical, auto-catalytic procedure based on the contrasting electro-negativity of | MULTILAYER BOARDS PLANT | copper ...
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