... and the Frauenhofer Institute, for which a patent has been applied, we have managed to eliminate the quality pifalls as well as to combine | CIRCUIT BOARDS TECHNOLOGIES | all of the work steps, from stock recognition to CNC drilling into one step. The advantages for cost and competiveness are immense ! The Problem | CIRCUIT BOARDS TECHNOLOGIES | Multi-layer pressing can only guarantee the best innerlayer adhesion if the fibre glass mats soaked in epoxide resin (prepregs), positioned between the innerlayers as a | CIRCUIT BOARDS TECHNOLOGIES | dielektric medium, gel. As a result of the high pressures (150 bar) and temperatures (175 C) applied the resin becomes so fluid that the inner-layers actually | CIRCUIT BOARDS TECHNOLOGIES | swim and expand due to the heat. This can result in undefined dimension instabilities as well as inner-layer alignment. It is extremely difficult to investigate | CIRCUIT BOARDS TECHNOLOGIES | the layer alignment as it is concealed by the unfinished outer copper foil and prepregs. The results are extreme drill alignments and, in extreme cases, | CIRCUIT BOARDS TECHNOLOGIES | fractured edges. Conventional Solution Attempts The most ...
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... plane layers. For some reason, CAD engineers like them to be "positive," but those types of layers lead to huge file sizes. Negative plane | CIRCUIT BOARDS TECHNOLOGIES | layers are usually preferred by fabricators because they're easier to work with and have smaller file sizes than positive layers. Remember, boards are manufactured en | CIRCUIT BOARDS TECHNOLOGIES | masse and must be stepped out into a panelized form. The result: Data sets with lots of unnecessary positive planes swell exponentially, bog down CAM | CIRCUIT BOARDS TECHNOLOGIES | systems, and crash photoplotters. After the basic prep work is completed, step into the fabrication | PRINTED CIRCUIT BOARDS | analysis arena, where the game | CIRCUIT BOARDS TECHNOLOGIES | is one of checks and balances. You've got your design rules; fabricators have theirs. Checks and balances can resolve any conflicts between the two. | | CIRCUIT BOARDS TECHNOLOGIES | TAKE SOLDERMASK LAYERS |, for instance. Often, these layers are not "intelligent" layers within a CAD tool; that is, there is not much in the | CIRCUIT BOARDS TECHNOLOGIES | way of capability checking within the tool. As a result, these are among the more ...
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... to ensure that the finished board is to your requirements. - Always required even when a drill file is supplied, to enable inspection of | CIRCUIT BOARDS TECHNOLOGIES | panels immediately after drilling and finished boards prior to despatching. Hole sizes must be clearly represented with distinct differences between each size. Tolerances are not | CIRCUIT BOARDS TECHNOLOGIES | required unless different to our standard of +0.1 / -0.05 mm. - Preferred with overall mechanical dimensions including notches, cutouts and slots. Also preferred is | CIRCUIT BOARDS TECHNOLOGIES | a positioning (datum) dimension (drilled hole is best). Tolerances are not required unless different to our standard of + / -0.25 mm. Other information required | CIRCUIT BOARDS TECHNOLOGIES | for all boards includes: board thickness (standard = 1.6mm) base copper thickness (std = 18mm) solder mask colour (std = green) solder mask type (std | CIRCUIT BOARDS TECHNOLOGIES | = liquid photoimageable) component legend colour (std = white) bare board testing requirement (std for multilayer and fine line production runs) Extra information required for | CIRCUIT BOARDS TECHNOLOGIES | multilayers includes: ...
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