... process times. DMS-E deposits a conductive polymer that may be produced either in the horizontal mode using specially designed horizontal processing equipment or in | CIRCUIT BOARDS PROTOTYPING | the vertical mode using a standard immersion type plating line. The DMS-E system consistently delivers highly reliable plated through-holes on all commonly used laminate materials, | CIRCUIT BOARDS PROTOTYPING | PWB complexities and in a variety of operating conditions. Production-proven in both vertical and horizontal process equipment, the versatile system yields total process cost reduction | CIRCUIT BOARDS PROTOTYPING | Panel Plating a Flash of Copper The panels are online in a wet state transferred to our automatic electrolytic copper plating lines to get a | CIRCUIT BOARDS PROTOTYPING | flasch of copper.. The panels are attached to plating racks. When the racks are moved to the loading station, the system computer instructs the hoist | CIRCUIT BOARDS PROTOTYPING | to pick up the rack and begin the plating cycle. The copper plating time is approximately one hour. Electrolytic copper of minimum thickness 12 microns | CIRCUIT BOARDS PROTOTYPING | is deposited on the ...
[ Circuit Boards Prototyping ]


... unclad substrate with electroplating or with etching, or with both | SMOBC SOLDER MASK OVER BARE COPPER. | A method of fabricating a printed | CIRCUIT BOARDS PROTOTYPING | wiring board which results in the final metallization being copper with no other protective metal but the non soldered areas are coated by a solder | CIRCUIT BOARDS PROTOTYPING | resist, exposing only the component terminal areas. | SOLDER LEVELING |The process of dipping PCB's into hot liquids, or exposing them to liquid waves to | CIRCUIT BOARDS PROTOTYPING | achieve fusion. First, flux is applied to the board by dipping or brushing. Then the board is preheated in a liquid (maintained at 250 F). | CIRCUIT BOARDS PROTOTYPING | Next, the board is immersed in fusing liquid at 430 - 500 F. Finally, it is dipped in another 250 F liquid to cool it | CIRCUIT BOARDS PROTOTYPING | and reduce thermal shock. Thin fused coatings can be applied. | SOLDER RESISTS (SOLDERMASK) | Coatings which mask off and surface insulate those areas of | CIRCUIT BOARDS PROTOTYPING | a circuit where soldering is not desired. | STEP AND REPEAT | A method by which successive exposures of a single image are made to | CIRCUIT BOARDS PROTOTYPING | produce a ...
[ Circuit Boards Prototyping ]


... in the vertical mode, vibration is recommended for each processing stage. The DMS-E process includes no cleaning sequence, therefore copper surfaces should be clean | CIRCUIT BOARDS PROTOTYPING | and holes should be free of all drill debris. This may be achieved by chemical cleaning (e.g. ultrasonics) or by brushing with an ultrasonic section | CIRCUIT BOARDS PROTOTYPING | to remove the drill debris prior to the DMS-E process. When processing double-sided panels through a horizontal line using sulfuric acid (e.g. Stabilizer) it is | CIRCUIT BOARDS PROTOTYPING | important to ensure that the through-holes are clean. This may be accomplished by introducing a desmear pretreatment. Used by over 150 PWB fabricators worldwide, the | CIRCUIT BOARDS PROTOTYPING | DMS-E system consistently delivers highly reliable plated through-holes on all commonly used laminate materials, PWB complexities and in a variety of operating conditions. Production-proven in | CIRCUIT BOARDS PROTOTYPING | both vertical and horizontal process equipment, the versatile system yields total process cost reduction. TEST-RESULTS Tests Material Aspect Ratio Hole Way ...
[ Circuit Boards Prototyping ]