... solved de-centrally, at the place of action. This is exactly the principle that we have adopted in our production. Although logistics and distribution still | CIRCUIT BOARDS PROTOTYPE | determine when an order must be completed, it is the operators in the departments themselves who are responsible for the regulation of a smooth flow | CIRCUIT BOARDS PROTOTYPE | of production. From the first production step, the respective operators promise to complete all RMP orders by a certain date. In this way the operator | CIRCUIT BOARDS PROTOTYPE | responsible for the subsequent step can have all of his technical and organisational equipment fully prepared to receive the handover of the order. If he | CIRCUIT BOARDS PROTOTYPE | knows the time point, he is also obliged to | "PROMISE“ | the time of completion by his department so that the following operator can | CIRCUIT BOARDS PROTOTYPE | be prepared, and so on. By means of a PPS support system expressly developed for this purpose, communication between operators has been simplified to the | CIRCUIT BOARDS PROTOTYPE | extent that organisational work is minimal. In addition to the organisation, of planning, ...
[ Circuit Boards Prototype ]


... to hot air levelled solder is a combined electroless nickel / immersion gold finish. Panels are initially chemically cleaned and etched to prepare the | CIRCUIT BOARDS PROTOTYPE | copper surfaces for deposition of the catalyst necessary to initiate the electroless nickel-plating process. After catalysing, the panels are immersed firstly in the nickel bath | CIRCUIT BOARDS PROTOTYPE | and then rinsed prior to being transferred to the immersion gold bath. The complete process deposits some 5 microns of nickel and a layer of | CIRCUIT BOARDS PROTOTYPE | pure gold of thickness approximately 0.07 microns. The function of the gold is simply to prevent oxidation of the underlying nickel, which is the solderable | CIRCUIT BOARDS PROTOTYPE | finish. Test panels are run on the line at regular intervals to monitor etch rates (by weight loss) and plating rates (by weight gain). After | CIRCUIT BOARDS PROTOTYPE | gold plating the panels are rinsed and dried in preparation for inspection. A visual assessment is carried out for surface imperfections and the panels tape-tested | CIRCUIT BOARDS PROTOTYPE | to ensure satisfactory adhesion of both plating and ...
[ Circuit Boards Prototype ]


... the PCB layout (check out those negative planes!). You output the 274X and IPC-D-356 netlist files. The data are fed into a fab analysis | CIRCUIT BOARDS PROTOTYPE | tool and run through their paces. Clearances are good. No possible soldermask flaking. Spacing between the drills is just right. You hand the data set | CIRCUIT BOARDS PROTOTYPE | to the fabricator, and voila! No unexpected phone calls, no changes in the layout, and the fabricator happily sends back a good set of boards | CIRCUIT BOARDS PROTOTYPE | on time. Our recommendations for the correct storage of PCBs and MLBs A.1 ) Brief desricption of the problem: PCB`s, especially Multilayer boards are extremly | CIRCUIT BOARDS PROTOTYPE | sensitive towards moisture The microscopic structure of the Multilayer material develops a strong capillary power that soaks up the humidity of the surrounding air. Even | CIRCUIT BOARDS PROTOTYPE | under very dry conditions it is a question of time that water accumulates in the stored PCB`s. For example: At storage conditions of 20 C° | CIRCUIT BOARDS PROTOTYPE | and 35 % of humidity the weight of the epoxyraisin of the Multilayer PCB`s rises 0,12 % due ...
[ Circuit Boards Prototype ]