... narrow processing slit. The process of solder mask coating as well as de- oxidation of bare copper surfaces (activation) must perfectly match the gold | CIRCUIT BOARDS PLANT | plating. To prevent the risk of poor metallic deposition on the gold surface, vias must be completely free of solder mask coating or be completely closed | CIRCUIT BOARDS PLANT | by means of a special filling process. Curing of the solder mask coating must also concur with that of the chemical gold plating as it | CIRCUIT BOARDS PLANT | is exposed to hydrogen in the 90° C nickel baths. One has the choice between an expensive coating system or a subsequent infrared solidification which, | CIRCUIT BOARDS PLANT | in turn, also calls for further investment in facilities. THE POTENTIAL For a lead free altenative provided the PCB manufacturer ensures optimal conditions for immersion | CIRCUIT BOARDS PLANT | nickel gold coating, the results of wave soldering are equally good to solder levelling. Good storage ability is also achieved by covering the pad and | CIRCUIT BOARDS PLANT | smd sides with gold. In our opinion, however, immersion nickel / gold will never ...
[ Circuit Boards Plant ]


... solder film base metal is not exposed. | DIELECTRIC | Any insulating medium which intervenes between two conductors. | DIELECTRIC | Breakdown A complete | CIRCUIT BOARDS PLANT | failure of a dielectric material characterized by a disruptive electrical discharge through the material due to a sudden and large increase in voltage. | DIELECTRIC | CIRCUIT BOARDS PLANT | STRENGTH | The maximum voltage that an insulating material can withstand before breakdown occurs. | DIGITAL CIRCUIT | A circuit comprised of mostly integrated circuits | CIRCUIT BOARDS PLANT | which operates like a switch(i.e., it is either "ON" or "OFF"). | DIGITIZING | The process of reducing feature locations on a flat plane to | CIRCUIT BOARDS PLANT | digital representation of X-Y coordinates. | DIMENSIONAL HOLE | A hole in a printed board where the means of determining location is by coordinate values | CIRCUIT BOARDS PLANT | not necessarily coinciding with the stated grid. | DIMENSIONAL STABILITY | A freedom from distortion caused by such factors as temperature, humidity, chemical treatment, age, | CIRCUIT BOARDS PLANT | or stress. | DIP SOLDERING | A process ...
[ Circuit Boards Plant ]


... > TERMINOLOGY AND TERMS OF PRINTED CIRCUIT BOARDS | | HOLE BREAKOUT | A condition in which a hole is not completely surrounded by | CIRCUIT BOARDS PLANT | the land. | HOLE DENSITY | The quantity of holes in a printed board per unit area. | HOLE LOCATION | - The dimensional location | CIRCUIT BOARDS PLANT | of the center of a hole. | HOLE PATTERN | The arrangement of all holes in a printed board. | HOLE PREPARATION | The hole | CIRCUIT BOARDS PLANT | prior to plating shall be clean cut and free of burrs, loose or hanging fibers, copper dust and resin dust. | HOLE PULL STRENGTH | | CIRCUIT BOARDS PLANT | The force (in pounds) necessary to rupture a plated-through hole when loaded or pulled in the direction of the axis of the hole. | HOLE | CIRCUIT BOARDS PLANT | |Void A void in the metallic deposit of a plated-through ...
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