Circuit Boards Online The chemical process of preparing a plastic surface to provide for a uniform, well-bonded metallic overplate.

 

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... REFINED: THE IMMERSION NICKEL GOLD PCBS APPLICATION AREAS Immersion nickel gold process has long been an established surface refining process among printed circuit board | CIRCUIT BOARDS ONLINE | techniques. However, in spite of many advantages over conventional solder levelling it has only been adopted for certain application areas. Nickel gold is utilized in | CIRCUIT BOARDS ONLINE | particular where PCB surfaces are exposed to aggressive environments, for instance in mobile phones, or automobile electronics. Due to the consistent chemical precipitation of metal, | CIRCUIT BOARDS ONLINE | gold is the obvious choice for all fine-pitch assemblings with under 0,5 mm grid spaces. Due to its smooth excellence, the immersion nickel gold surface | CIRCUIT BOARDS ONLINE | is a better alternative to HAL, particularly for narrow SMD grids on both side of PCB`s. The actual wiring of a component is effected by | CIRCUIT BOARDS ONLINE | means of a 4-6 my thick layer of nickel, and not by means of the extremely fine 0,05 to 0,2 my layer of gold which | CIRCUIT BOARDS ONLINE | merely serves as an oxidation and diffusion blockage in order to extend ...
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... package must be kept intact although the polyethylene packages capability of keeping humidity away is not really reliable. A.3 2 ) Storage time The | CIRCUIT BOARDS ONLINE | storage time of PCB`s should be as short as possible. PCB`s should be taken out due to the „first-in, first out“ rule. The the polyethylene | CIRCUIT BOARDS ONLINE | packages should be taken away just before the assembling. Remaining PCB`s should be repacked again. To avoid exposure to draught, the packages should be stored | CIRCUIT BOARDS ONLINE | in boxes. A.4 3 ) Soldering tests PCB`s stored for over several months and being transported under questionable conditions, should be submitted again to a | CIRCUIT BOARDS ONLINE | soldering test, being equivalent to your soldering process. A.5 4 ) Heat conditioning of the PCB`s In any case we suggest a drying process of | CIRCUIT BOARDS ONLINE | the PCB`s in a stove to reduce the moisture in the PCB`s to an acceptable minimum. Following parameters can be recommended: A6) Drying time: Temperature | CIRCUIT BOARDS ONLINE | C° 8 hours 120 10 hours 100 18 hours 80 Lower drying temperatures are also possible but need ...
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... – 20µ 37 % lead/63 % tin Electrolytic nickel/gold* 1µ – 3µ gold up to 5µ nickel Immersion nickel/ (flash) gold* 0,05µ – 0,1µ | CIRCUIT BOARDS ONLINE | gold up to 5µ nickel Immersion nickel/ (bond) gold* 0,3µ gold up to 5µ nickel Immersion chemical tin* 1µ very high planarity Organic surface protection | CIRCUIT BOARDS ONLINE | (OSP) organic coating of copper ENTEK PLUS Cu - 106 5.8 Text printing, additional printing techniques Silk screen printing Standard µ Special µ Technical limit | CIRCUIT BOARDS ONLINE | µ Silk screen to Pads spacing 300 250 200 Silk screen to PTH spacing 300 250 200 Line width 200 175 140 Minimum size of | CIRCUIT BOARDS ONLINE | letters 1250 1000 800 Carbon key pad printing Standard (µ) Special (µ) Technical limit (µ) Track to track spacing 500 400 400 Minimum track width | CIRCUIT BOARDS ONLINE | 500 400 300 Peelable mask Standard Special Technical limit Max diameter of covered holes 1,8 mm 2,0 mm 2,6*mm Thickness of peelable mask 300µ 400µ | CIRCUIT BOARDS ONLINE | 500µ *coverage cannot be guaranteed 5.9 Contour machining Contouring is performed by three possible techniques: * Routing * V-cutting These ...
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