... the production process. The days of the first “printed circuits” which could be checked simply with the naked eye are over. Today, high-tech equipment | CIRCUIT BOARDS MANUFACTURING | is necessary for a thorough PCB test. Optical checks with the aid of conventional microscopic equipment are sufficient for one-sided and relatively simple double-sided PCBs. | CIRCUIT BOARDS MANUFACTURING | Residues, constricted conductors and sub-corrosions can be discovered which would otherwise lead to PCB failure after a number of operational hours. An electrical test is | CIRCUIT BOARDS MANUFACTURING | needed to check the actual functions of a PCB. It is an essential if inner layers need to be tested, as is the case with | CIRCUIT BOARDS MANUFACTURING | multi-layers. In two position measurements all connections in the PCB are checked for stoppages and short circuits . All SMD pads and plated through holes | CIRCUIT BOARDS MANUFACTURING | are checked. The electrical test can be conducted as a parallel or finger test. PARALLEL TEST: For the parallel test a control adaptor is constructed, | CIRCUIT BOARDS MANUFACTURING | consisting, e.g. of several synthetic sheets positioned above each other ...
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... Multilayer Lamination Press ML Lamination Press The book is then transferred to the vacuum lamination press proved to be a major step forward. In | CIRCUIT BOARDS MANUFACTURING | this approach, the books are enclosed in a vacuum tight chamber, permitting lamination to take place in a vacuum environment. The press applies heat and | CIRCUIT BOARDS MANUFACTURING | pressure so that the thermosetting resin in the prepreg undergoes cross-linking which bonds all layers together. The press then goes through a critical cooling cycle | CIRCUIT BOARDS MANUFACTURING | before the book is removed and pulled apart. The edges of the multilayer panels are then trimmed to eliminate any of the resin outflow and | CIRCUIT BOARDS MANUFACTURING | to smooth out uneven or rough edges. Special attention was given to environmental compatibility and safety conditions. Furthermore, the facility was designed to accommodate future | CIRCUIT BOARDS MANUFACTURING | expansions. The requirements were as follows: - LP formats: Up to 640 x 610 mm - LP thickness: 0.30 – 10.0 mm - Materials: FR- | CIRCUIT BOARDS MANUFACTURING | 4, BT-epoxy, ...
[ Circuit Boards Manufacturing ]


... decoration, or other purposes. The object to be plated is placed in an electrolyte and connected to one terminal of a DC voltage source. | CIRCUIT BOARDS MANUFACTURING | The metal to be deposited is similarly immersed and connected to the other terminals. Ions of the metal provide transfer to metal as they make | CIRCUIT BOARDS MANUFACTURING | up the current flow between electrodes. | EPOXY SMEAR | Epoxy resin which has been deposited onto the edges of the conductive pattern during drilling. | CIRCUIT BOARDS MANUFACTURING | Also called Resin Smear. | ETCH FACTOR | The ratio of the depth of etch (conductor thickness) to the amount of lateral etch (undercut). | | CIRCUIT BOARDS MANUFACTURING | ETCHBACK | The controlled removal of all components of base material by a chemical process on the sidewalls of plated through holes in order to | CIRCUIT BOARDS MANUFACTURING | expose | ETCHING | The process of removing unwanted metallic substance (bonded to base) via chemical or chemical and electrolytic means. | ETCHING RESISTS | | CIRCUIT BOARDS MANUFACTURING | Materials deposited on the surface of a copper-clad base material that prevent the removal by etching of the conductive areas ...
[ Circuit Boards Manufacturing ]