... OS. | FINAL COPPER THICKNESS | The copper thickness stated in the PCB specification. This thickness is to be understood as the total thickness | CIRCUIT BOARDS | of copper foil + copper plating. Fine-pitch SMD component with center-to-center terminal distances of less than 0,635 mm. Fluxing The process of removing oxides from | CIRCUIT BOARDS | a PCB to prepare it for soldering. Fluxing lowers the surface tension of the solder and helps promote the formation of good solder fillets. Foil | CIRCUIT BOARDS | A thin continuous sheet of metal, usually copper or aluminum, used as the conductor for printed circuits. Foils used for printed circuits are commonly 1 | CIRCUIT BOARDS | or 2 ounces per square foot the thinner the foil, the lower the required etch time. Thinner foils also permit finer definition and spacing. See | CIRCUIT BOARDS | Copper Foil. | FULLY ADDITIVE PROCESS |An additive process wherein the entire thickness of electrically isolated conductors is built up by electroless metal deposition. Synonymous | CIRCUIT BOARDS | with Fully Electroless. | FUSING (REFLOW) | The melting of a ...
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... baths. One has the choice between an expensive coat-ing system or a subsequent infrared solidification which, in turn, also calls for further investment in | CIRCUIT BOARDS | facilities. The potential for a lead-free alternative For a lead free altenative provided the PCB manufacturer ensures optimal conditions for immersion nickel gold coating, the | CIRCUIT BOARDS | results of wave soldering are equally good to solder levelling. Good storage ability is also achieved by covering the pad and smd sides with gold. | CIRCUIT BOARDS | In our opinion, however, immersion nickel / gold will never become an established alternative to HAL. As already mentioned, the processing costs are the greatest | CIRCUIT BOARDS | handicap for this method. However, due to the lack of other alternatives in the lead-free future immersion nickel / gold will retain its position in | CIRCUIT BOARDS | the area of fine pitch and COB applications. Cost disadvantages of the immersion nickel / gold process could be balanced, in particular in the production | CIRCUIT BOARDS | of large series (consumer goods), if the use ...
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... to the compulsory implementation of lead-free regulations (ROHS), the greater the attempts to achieve lead-free solutions that are comparable to the “all-purpose answer” SnPb | CIRCUIT BOARDS | in terms of technology and cost. Two systems are particularly predominant: tin/silver/copper (SnAgCu) and, more recently, stabilised tin/copper (SnCuNi). Although the level of efficiency of | CIRCUIT BOARDS | both systems is not yet completely clear, the following presents the latest information: SnAgCu There is more experience in the field of silver systems. Here, | CIRCUIT BOARDS | differentiation is made between the Sn-3.5Ag-0.7Cu, Sn-4Ag-0.5Cu and Sn-3Ag- 0.5Cu systems which vary in use from continent to continent. However, the agreed expert opinion (IPC/Soldertech-Conference | CIRCUIT BOARDS | Brussels 2003) is that the technological differences between the three systems are negligible. Sn-3.5Ag- 0.7Cu is the most common alloy in Europe. SnCuNi Although there | CIRCUIT BOARDS | are even fewer field results for the stabilised tin/copper system Sn-0.7Cu-0.1Ni, it shows a lot of ...
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