... quality board to be produced. Another important criteria is the presence of orientation marks within the boundary of board. These marks could be the | CIRCUIT BOARD | board reference so long as it cannot be read from the other side. (This is for your protection to prevent the boards made inside out). | CIRCUIT BOARD | | IMAGES | should comply with design rules that will result in a board that will meet performance and cost requirements. - | SCALE MUST | CIRCUIT BOARD | BE GIVEN, | tapes securely stuck to the backing sheet, track to pad & track to track joints complete and the backing sheet clean. - | CIRCUIT BOARD | Scale must be given and be at least 2:1. Plots must also offer sharp edge definition and traces dense enough for blocking light when photographing. | CIRCUIT BOARD | - Preferred on 7mil (178mm) thick base for stability. Films should be plotted on laser photoplotter or on vector photoplotter using a minimum resolution of | CIRCUIT BOARD | ½mil (13mm). - Preferred in Gerber® format although accepted in other formats. (Refer to CID- 014 for information on Documentation in ...
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... being, that for mixed components and other multi-thermic processes, the organic protection layer breaks off at temperatures above 150? C . All in all, | CIRCUIT BOARD | the area of use for soldering at higher melting temperatures has not yet been reliably tested. In addition, OSP does not bond. The ability to | CIRCUIT BOARD | bond with soldering paste – in particular with lead-free soldering paste – depends greatly on the soldering procedure, such as convection ovens with or without | CIRCUIT BOARD | a nitrogen atmosphere, high cooker ovens, etc Tests so far show that bonding is not as good as with the other named surfaces. Therefore, the | CIRCUIT BOARD | self-centralising effect is noticeably lower and requires greater precision of solder paste pressure. In addition, the test for soldering ability showed that emphasis should be | CIRCUIT BOARD | placed on a suitable flux agent, as this, in addition to the thermic effect, also leads to the removal of the OSP layer. In Europe, | CIRCUIT BOARD | there is a lack of enthusiasm for OSP, especially due to the great demands made on the ...
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... which the order and the complete production data are made available not later than 6 p.m., does not count as a working day. If | CIRCUIT BOARD | the order and/or the production data are made available after 6 p.m., the first working day is t he day after next. 1.2 Technical preconditions: | CIRCUIT BOARD | Productions data and orders which are faulty, incomplete, or vary from the details on which the offer is based lead to delays in delivery and/or | CIRCUIT BOARD | incorrect execution of the order, etc. | 2. LIABILITY DISCLAIMER | 2.1 We do not accept responsibility for any errors incurred when referring to offers | CIRCUIT BOARD | or when enquiring. | 3. CORRECT SIDE | PRINTED CIRCUIT BOARDS | 3.1 In order to be able to recognise the correct side (mirrored or | CIRCUIT BOARD | unmirrored image) legible type must be visible in an external position on the conductive pattern. 3.2 The order of layer construction must be given for | CIRCUIT BOARD | multilayers. We are not liable for correct execution if we are not provided with this information. | 4. CONFUSION | We cannot accept liability ...
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